Issued Patents All Time
Showing 26–50 of 88 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7342183 | Circuitized substrate with sintered paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same | Voya R. Markovich, Luis J. Matienzo | 2008-03-11 |
| 7334323 | Method of making mutilayered circuitized substrate assembly having sintered paste connections | Voya R. Markovich, Luis J. Matienzo | 2008-02-26 |
| 7325299 | Method of making a circuitized substrate | Kevin Knadle, Andrew Seman | 2008-02-05 |
| 7309529 | Structure and method for improved adhesion between two polymer films | Luis J. Matienzo | 2007-12-18 |
| 7307022 | Method of treating conductive layer for use in a circuitized substrate and method of making said substrate having said conductive layer as part thereof | Stephen Krasniak, John M. Lauffer, Voya R. Markovich, Luis J. Matienzo | 2007-12-11 |
| 7301108 | Multi-layered interconnect structure using liquid crystalline polymer dielectric | Donald S. Farquhar, Voya R. Markovich, Mark D. Poliks, Douglas O. Powell | 2007-11-27 |
| 7292055 | Interposer for use with test apparatus | How T. Lin | 2007-11-06 |
| 7185428 | Method of making a circuitized substrate | Kevin Knadle, Andrew Seman | 2007-03-06 |
| 7083901 | Joining member for Z-interconnect in electronic devices without conductive paste | Voya R. Markovich, Thomas R. Miller, Douglas O. Powell, James R. Wilcox | 2006-08-01 |
| 7084509 | Electronic package with filled blinds vias | Elizabeth Foster, Raymond T. Galasco, Voya R. Markovich, Manh-Quan Nguyen | 2006-08-01 |
| 7067193 | Structure and method for improved adhesion between two polymer films | Luis J. Matienzo | 2006-06-27 |
| 7045897 | Electrical assembly with internal memory circuitized substrate having electronic components positioned thereon, method of making same, and information handling system utilizing same | John M. Lauffer, How T. Lin, Voya R. Markovich, David L. Thomas | 2006-05-16 |
| 7011531 | Membrane probe with anchored elements | Keith J. Miller, Manh-Quan Nguyen | 2006-03-14 |
| 6955849 | Method and structure for small pitch z-axis electrical interconnections | Brian E. Curcio, Robert M. Japp, Thomas R. Miller, Manh-Quan Nguyen, Douglas O. Powell | 2005-10-18 |
| 6924224 | Method of forming filled blind vias | Elizabeth Foster, Raymond T. Galasco, Voya R. Markovich, Manh-Quan Nguyen | 2005-08-02 |
| 6905589 | Circuitized substrate and method of making same | Voya Markovich, Thomas R. Miller | 2005-06-14 |
| 6881072 | Membrane probe with anchored elements | Keith J. Miller, Manh-Quan Nguyen | 2005-04-19 |
| 6826830 | Multi-layered interconnect structure using liquid crystalline polymer dielectric | Donald S. Farquhar, Voya R. Markovich, Mark D. Poliks, Douglas O. Powell | 2004-12-07 |
| 6822332 | Fine line circuitization | Kevin Knadle, Andrew Seman | 2004-11-23 |
| 6790305 | Method and structure for small pitch z-axis electrical interconnections | Brian E. Curcio, Robert M. Japp, Thomas R. Miller, Manh-Quan Nguyen, Douglas O. Powell | 2004-09-14 |
| 6770968 | Method for bonding heat sinks to overmolds and device formed thereby | Michael A. Gaynes, Ramesh R. Kodnani, Luis J. Matienzo, Mark V. Pierson | 2004-08-03 |
| 6719871 | Method for bonding heat sinks to overmolds and device formed thereby | Michael A. Gaynes, Ramesh R. Kodnani, Luis J. Matienzo, Mark V. Pierson | 2004-04-13 |
| 6656313 | Structure and method for improved adhesion between two polymer films | Luis J. Matienzo | 2003-12-02 |
| 6613184 | Stable interfaces between electrically conductive adhesives and metals | Paul Logan, Luis J. Matienzo | 2003-09-02 |
| 6607613 | Solder ball with chemically and mechanically enhanced surface properties | Edmond O. Fey, Luis J. Matienzo, David L. Questad, Rajinder S. Rai, Daniel C. Van Hart | 2003-08-19 |