Issued Patents All Time
Showing 51–75 of 88 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6576996 | Method for bonding heat sinks to overmolds and device formed thereby | Michael A. Gaynes, Ramesh R. Kodnani, Luis J. Matienzo, Mark V. Pierson | 2003-06-10 |
| 6576549 | Fabrication of a metalized blind via | Elizabeth Foster, Raymond T. Galasco, David E. Houser, Mark L. Janecek, Thomas E. Kindl +7 more | 2003-06-10 |
| 6522014 | Fabrication of a metalized blind via | Elizabeth Foster, Raymond T. Galasco, David E. Houser, Mark L. Janecek, Thomas E. Kindl +7 more | 2003-02-18 |
| 6518516 | Multilayered laminate | Kim J. Blackwell, Voya R. Markovich, Manh-Quan Nguyen, Douglas O. Powell, David L. Thomas | 2003-02-11 |
| 6509546 | Laser excision of laminate chip carriers | John S. Kresge | 2003-01-21 |
| 6348738 | Flip chip assembly | Jean Dery, Luis J. Matienzo, Charles Ouellet, Luc Ouellet, David L. Questad +2 more | 2002-02-19 |
| 6337004 | High adhesion performance roll sputtered strike layer | Kim J. Blackwell, Pei C. Chen, Allan R. Knoll, George J. Matarese, Luis J. Matienzo | 2002-01-08 |
| 6306683 | Method of forming a flip chip assembly, and a flip chip assembly formed by the method | Jean Dery, Luis J. Matienzo, Charles Ouellet, Luc Ouellet, David L. Questad +2 more | 2001-10-23 |
| 6284329 | Method of forming adherent metal components on a polyimide substrate | Luis J. Matienzo, Kim J. Blackwell, Allan R. Knoll | 2001-09-04 |
| 6265462 | Method for Producing a Diffusion Barrier and Polymeric Article Having a Diffusion Barrier | Luis J. Matienzo, Bruce Otho Morrison, Jr. | 2001-07-24 |
| 6250540 | Fluxless joining process for enriched solders | Luis J. Matienzo | 2001-06-26 |
| 6252012 | Method for producing a diffusion barrier and polymeric article having a diffusion barrier | Luis J. Matienzo, Bruce Otho Morrison, Jr. | 2001-06-26 |
| 6232363 | Method for producing a diffusion barrier and polymeric article having a diffusion barrier | Luis J. Matienzo, Bruce Otho Morrison, Jr. | 2001-05-15 |
| 6210547 | Enhanced solder surface and process for chemically and mechanically enhancing solder surface properties | Edmond O. Fey, Luis J. Matienzo, David L. Questad, Rajinder S. Rai, Daniel C. Van Hart | 2001-04-03 |
| 6206997 | Method for bonding heat sinks to overmolds and device formed thereby | Michael A. Gaynes, Ramesh R. Kodnani, Luis J. Matienzo, Mark V. Pierson | 2001-03-27 |
| 6204305 | Method for producing a diffusion barrier and polymeric article having a diffusion barrier | Luis J. Matienzo, Bruce Otho Morrison, Jr. | 2001-03-20 |
| 6203652 | Method of forming a via in a substrate | John S. Kresge | 2001-03-20 |
| 6194076 | Method of forming adherent metal components on a polyimide substrate | Luis J. Matienzo, Kim J. Blackwell, Allan R. Knoll | 2001-02-27 |
| 6156484 | Gray scale etching for thin flexible interposer | Ernest Bassous, Gobinda Das, Natalie B. Feilchenfeld, Elizabeth Foster, Stephen Joseph Fuerniss +4 more | 2000-12-05 |
| 6074895 | Method of forming a flip chip assembly | Jean Dery, Luis J. Matienzo, Charles Ouellet, Luc Ouellet, David L. Questad +2 more | 2000-06-13 |
| 6056831 | Process for chemically and mechanically enhancing solder surface properties | Edmond O. Fey, Luis J. Matienzo, David L. Questad, Rajinder S. Rai, Daniel C. Van Hart | 2000-05-02 |
| 6000130 | Process for making planar redistribution structure | Chi-Shih Chang | 1999-12-14 |
| 5958996 | Method for producing a diffusion barrier and polymeric article having a diffusion barrier | Luis J. Matienzo, Bruce Otho Morrison, Jr. | 1999-09-28 |
| 5789121 | High density template: materials and processes for the application of conductive pastes | Douglas A. Cywar, Charles R. Davis, Thomas P. Duffy, Paul Joseph Hart, Gerald W. Jones +1 more | 1998-08-04 |
| 5774340 | Planar redistribution structure and printed wiring device | Chi-Shih Chang | 1998-06-30 |