Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8592299 | Solder and electrically conductive adhesive based interconnection for CZT crystal attach | Voya R. Markovich, Rabindra N. Das, Michael B. Vincent | 2013-11-26 |
| 8240031 | Method of joining a semiconductor device/chip to a printed wiring board | Voya R. Markovich, Ronald V. Smith, How T. Lin, Frank D. Egitto, Rabindra N. Das +1 more | 2012-08-14 |
| 7328506 | Method for forming a plated microvia interconnect | Miguel A. Jimarez, Ross W. Keesler, Voya R. Markovich, Cheryl L. Tytran-Palomaki | 2008-02-12 |
| 6607613 | Solder ball with chemically and mechanically enhanced surface properties | Frank D. Egitto, Edmond O. Fey, Luis J. Matienzo, David L. Questad, Daniel C. Van Hart | 2003-08-19 |
| 6492600 | Laminate having plated microvia interconnects and method for forming the same | Miguel A. Jimarez, Ross W. Keesler, Voya R. Markovich, Cheryl L. Tytran-Palomaki | 2002-12-10 |
| 6210547 | Enhanced solder surface and process for chemically and mechanically enhancing solder surface properties | Frank D. Egitto, Edmond O. Fey, Luis J. Matienzo, David L. Questad, Daniel C. Van Hart | 2001-04-03 |
| 6059952 | Method of fabricating coated powder materials and their use for high conductivity paste applications | Sung Kwon Kang, Sampath Purushothaman | 2000-05-09 |
| 6056831 | Process for chemically and mechanically enhancing solder surface properties | Frank D. Egitto, Edmond O. Fey, Luis J. Matienzo, David L. Questad, Daniel C. Van Hart | 2000-05-02 |