Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8240031 | Method of joining a semiconductor device/chip to a printed wiring board | Voya R. Markovich, How T. Lin, Frank D. Egitto, Rabindra N. Das, William E. Wilson +1 more | 2012-08-14 |
| 7629559 | Method of improving electrical connections in circuitized substrates | Subahu D. Desai, John M. Lauffer, How T. Lin, Voya R. Markovich | 2009-12-08 |
| 7441709 | Electronic card assembly | Benson Chan, How T. Lin, Voya R. Markovich | 2008-10-28 |
| 6982387 | Method and apparatus to establish circuit layers interconnections | Richard R. Hall, How T. Lin, Christopher J. Majka, Matthew F. Seward | 2006-01-03 |
| 6721187 | Multi-layered high density connections | Richard R. Hall, How T. Lin, Christopher J. Majka, Norman Corey Seastrand, Matthew F. Seward | 2004-04-13 |
| 6712261 | Solid conductive element insertion apparatus | Richard R. Hall, How T. Lin, Christopher J. Majka, Matthew F. Seward | 2004-03-30 |