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Human being tracking and monitoring system |
Benson Chan, Jianzhuang Huang |
2015-04-14 |
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Method for making a multilayered circuitized substrate |
Thomas J. Davis, John M. Lauffer, James J. McNamara, Jr., Voya R. Markovich |
2009-12-08 |
| 7629559 |
Method of improving electrical connections in circuitized substrates |
John M. Lauffer, How T. Lin, Voya R. Markovich, Ronald V. Smith |
2009-12-08 |
| 7326643 |
Method of making circuitized substrate with internal organic memory device |
How T. Lin, John M. Lauffer, Voya R. Markovich, David L. Thomas |
2008-02-05 |
| 7253502 |
Circuitized substrate with internal organic memory device, electrical assembly utilizing same, and information handling system utilizing same |
How T. Lin, John M. Lauffer, Voya R. Markovich, David L. Thomas |
2007-08-07 |
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Printed wiring board |
Anilkumar C. Bhatt, Ashwinkumar C. Bhatt, John M. Lauffer, Voya R. Markovich, Thomas R. Miller |
2004-05-25 |
| 6608757 |
Method for making a printed wiring board |
Anilkumar C. Bhatt, Ashwinkumar C. Bhatt, John M. Lauffer, Voya R. Markovich, Thomas R. Miller |
2003-08-19 |
| 6093335 |
Method of surface finishes for eliminating surface irregularities and defects |
Ashwinkumar C. Bhatt, John Christopher Camp, Voya R. Markovich, Michael Wozniak |
2000-07-25 |
| 6038137 |
Chip carrier having a chip mounted on an organic dielectric substrate overlaid with a photoimageable dielectric having circuitry thereon |
Ashwinkumar C. Bhatt, Thomas P. Duffy, Jeffrey Alan Knight |
2000-03-14 |
| 5798909 |
Single-tiered organic chip carriers for wire bond-type chips |
Ashwinkumar C. Bhatt, Thomas P. Duffy, Jeffrey Alan Knight |
1998-08-25 |
| 5724232 |
Chip carrier having an organic photopatternable material and a metal substrate |
Ashwinkumar C. Bhatt, Thomas P. Duffy, Jeffrey Alan Knight |
1998-03-03 |
| 5546321 |
Method and apparatus for the cross-sectional design of multi-layer printed circuit boards |
Chi-Shih Chang, Debra A. Gernhart, Phillip A. Hartley, Robert J. Haskins, Jr., Keith Ky Trieu Ho +5 more |
1996-08-13 |
| 5519633 |
Method and apparatus for the cross-sectional design of multi-layer printed circuit boards |
Chi-Shih Chang, Debra A. Gernhart, Phillip A. Hartley, Robert J. Haskins, Jr., Keith Ky Trieu Ho +5 more |
1996-05-21 |