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Benson Chan — 52 Patents

IBM: 30 patents #3,385 of 70,183Top 5%

ETEndicott Interconnect Technologies: 17 patents #7 of 87Top 9%

UNUnknown: 2 patents #12,644 of 83,584Top 20%

JUJds Uniphase: 1 patents #393 of 940Top 45%

TOThe Research Foundation For The State University O: 1 patents #2 of 17Top 15%

Bank of America: 1 patents #2,818 of 5,361Top 55%

Vestal, NY: #7 of 481 inventorsTop 2%

New York: #1,765 of 115,490 inventorsTop 2%

Overall (All Time): #50,240 of 4,157,543Top 2%

52 Patents All Time

Benson Chan has been granted 52 US patents while listed as an inventor at IBM. The first was granted in 1995 and the most recent in June 2023. Benson Chan ranks #50,240 of 4,157,543 US inventors in our database (top 1.2%). Patent records list Benson Chan in Vestal, NY, US.

Patents per Year

Issued Patents All Time

Showing 1–25 of 52 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11689115	Bidirectional AC-DC converter with multilevel power factor correction	Kalyan Yenduri, Sunil Dube, Pritam Das	2023-06-27
9451693	Electrically conductive adhesive (ECA) for multilayer device interconnects	Rabindra N. Das, Voya R. Markovich, John M. Lauffer, Roy H. Magnuson, Konstantinos I. Papathomas	2016-09-20
9007202	Human being tracking and monitoring system	Jianzhuang Huang, Subahu D. Desai	2015-04-14
8502082	Circuitized substrate utilizing three smooth-sided conductive layers as part thereof and electrical assemblies and information handling systems utilizing same	John M. Lauffer	2013-08-06
8196281	Method of applying force to electrical contacts on a printed circuit board	Matthew J. Lauffer	2012-06-12
8069012	Sampling sufficiency testing	Kenneth Ramaley, Andrew Melton Bridgeman	2011-11-29	$271,334,000
8028390	Spring actuated clamping mechanism	Matthew J. Lauffer	2011-10-04
7972178	High density connector for interconnecting fine pitch circuit packaging structures	David J. Alcoe	2011-07-05
7841741	LED lighting assembly and lamp utilizing same	John E. Kozol, John M. Lauffer, How T. Lin	2010-11-30
7738249	Circuitized substrate with internal cooling structure and electrical assembly utilizing same	Frank D. Egitto, How T. Lin, Roy H. Magnuson, Voya R. Markovich, David L. Thomas	2010-06-15
7713767	Method of making circuitized substrate with internal optical pathway using photolithography	How T. Lin, Roy H. Magnuson, Voya R. Markovich, Mark D. Poliks	2010-05-11
7679005	Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same	Frank D. Egitto, Roy H. Magnuson, Voya R. Markovich, David L. Thomas	2010-03-16
7552091	Method and system for tracking goods	How T. Lin, William Maines, Voya R. Markovich	2009-06-23
7541058	Method of making circuitized substrate with internal optical pathway	How T. Lin, Roy H. Magnuson, Voya R. Markovich, Mark D. Poliks	2009-06-02
7501839	Interposer and test assembly for testing electronic devices	Frank D. Egitto, Voya R. Markovich	2009-03-10
7441709	Electronic card assembly	How T. Lin, Voya R. Markovich, Ronald V. Smith	2008-10-28
7252515	Non-oriented wire in elastomer electrical contact	William L. Brodsky, William E. Buchler, Jr., Michael A. Gaynes	2007-08-07	$6,917,000
7204697	Non-oriented wire in elastomer electrical contact	William L. Brodsky, William E. Buchler, Jr., Michael A. Gaynes	2007-04-17	$6,339,000
7152319	Method of making high speed circuit board	John M. Lauffer, How T. Lin, Voya R. Markovich, David L. Thomas	2006-12-26
7142121	Radio frequency device for tracking goods	William Kimler, How T. Lin, William Maines, Voya R. Markovich	2006-11-28
7108809	Optical coupler replication arrangement and process	Richard R. Hall, How T. Lin, Christopher J. Majka, John H. Sherman	2006-09-19	$6,659,000
6995322	High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same	John M. Lauffer	2006-02-07
6981880	Non-oriented wire in elastomer electrical contact	William L. Brodsky, William E. Buchler, Jr., Michael A. Gaynes	2006-01-03	$6,490,000
6974915	Printed wiring board interposer sub-assembly and method	William L. Brodsky, Michael A. Gaynes, Voya R. Markovich	2005-12-13	$5,273,000
6964884	Circuitized substrates utilizing three smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing same	John M. Lauffer	2005-11-15