Issued Patents All Time
Showing 25 most recent of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11689115 | Bidirectional AC-DC converter with multilevel power factor correction | Kalyan Yenduri, Sunil Dube, Pritam Das | 2023-06-27 |
| 9451693 | Electrically conductive adhesive (ECA) for multilayer device interconnects | Rabindra N. Das, Voya R. Markovich, John M. Lauffer, Roy H. Magnuson, Konstantinos I. Papathomas | 2016-09-20 |
| 9007202 | Human being tracking and monitoring system | Jianzhuang Huang, Subahu D. Desai | 2015-04-14 |
| 8502082 | Circuitized substrate utilizing three smooth-sided conductive layers as part thereof and electrical assemblies and information handling systems utilizing same | John M. Lauffer | 2013-08-06 |
| 8196281 | Method of applying force to electrical contacts on a printed circuit board | Matthew J. Lauffer | 2012-06-12 |
| 8069012 | Sampling sufficiency testing | Kenneth Ramaley, Andrew Melton Bridgeman | 2011-11-29 |
| 8028390 | Spring actuated clamping mechanism | Matthew J. Lauffer | 2011-10-04 |
| 7972178 | High density connector for interconnecting fine pitch circuit packaging structures | David J. Alcoe | 2011-07-05 |
| 7841741 | LED lighting assembly and lamp utilizing same | John E. Kozol, John M. Lauffer, How T. Lin | 2010-11-30 |
| 7738249 | Circuitized substrate with internal cooling structure and electrical assembly utilizing same | Frank D. Egitto, How T. Lin, Roy H. Magnuson, Voya R. Markovich, David L. Thomas | 2010-06-15 |
| 7713767 | Method of making circuitized substrate with internal optical pathway using photolithography | How T. Lin, Roy H. Magnuson, Voya R. Markovich, Mark D. Poliks | 2010-05-11 |
| 7679005 | Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same | Frank D. Egitto, Roy H. Magnuson, Voya R. Markovich, David L. Thomas | 2010-03-16 |
| 7552091 | Method and system for tracking goods | How T. Lin, William Maines, Voya R. Markovich | 2009-06-23 |
| 7541058 | Method of making circuitized substrate with internal optical pathway | How T. Lin, Roy H. Magnuson, Voya R. Markovich, Mark D. Poliks | 2009-06-02 |
| 7501839 | Interposer and test assembly for testing electronic devices | Frank D. Egitto, Voya R. Markovich | 2009-03-10 |
| 7441709 | Electronic card assembly | How T. Lin, Voya R. Markovich, Ronald V. Smith | 2008-10-28 |
| 7252515 | Non-oriented wire in elastomer electrical contact | William L. Brodsky, William E. Buchler, Jr., Michael A. Gaynes | 2007-08-07 |
| 7204697 | Non-oriented wire in elastomer electrical contact | William L. Brodsky, William E. Buchler, Jr., Michael A. Gaynes | 2007-04-17 |
| 7152319 | Method of making high speed circuit board | John M. Lauffer, How T. Lin, Voya R. Markovich, David L. Thomas | 2006-12-26 |
| 7142121 | Radio frequency device for tracking goods | William Kimler, How T. Lin, William Maines, Voya R. Markovich | 2006-11-28 |
| 7108809 | Optical coupler replication arrangement and process | Richard R. Hall, How T. Lin, Christopher J. Majka, John H. Sherman | 2006-09-19 |
| 6995322 | High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same | John M. Lauffer | 2006-02-07 |
| 6981880 | Non-oriented wire in elastomer electrical contact | William L. Brodsky, William E. Buchler, Jr., Michael A. Gaynes | 2006-01-03 |
| 6974915 | Printed wiring board interposer sub-assembly and method | William L. Brodsky, Michael A. Gaynes, Voya R. Markovich | 2005-12-13 |
| 6964884 | Circuitized substrates utilizing three smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing same | John M. Lauffer | 2005-11-15 |