Benson Chan

IBM: 30 patents #3,369 of 70,183Top 5%

ET Endicott Interconnect Technologies: 17 patents #7 of 87Top 9%

UN Unknown: 2 patents #12,644 of 83,584Top 20%

JU Jds Uniphase: 1 patents #393 of 940Top 45%

TO The Research Foundation For The State University O: 1 patents #2 of 17Top 15%

Bank of America: 1 patents #2,766 of 5,361Top 55%

📍 Vestal, NY: #7 of 481 inventorsTop 2%

🗺 New York: #1,754 of 115,490 inventorsTop 2%

Overall (All Time): #50,776 of 4,157,543Top 2%

Patents All Time

Issued Patents All Time

Showing 51–52 of 52 patents

Patent #	Title	Co-Inventors	Date
5530291	Electronic package assembly and connector for use therewith	Fletcher L. Chapin, Vincent M. Fiacco, John R. Mankus, Robert S. Pokrzywa	1996-06-25
5468996	Electronic package assembly and connector for use therewith	Fletcher L. Chapin, Vincent M. Fiacco, John R. Mankus, Robert S. Pokrzywa	1995-11-21