MW

Michael Wozniak

IBM: 16 patents #6,952 of 70,183Top 10%
ET Endicott Interconnect Technologies: 4 patents #26 of 87Top 30%
UN Unknown: 2 patents #12,644 of 83,584Top 20%
Overall (All Time): #180,557 of 4,157,543Top 5%
23
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11961193 Method for controlling a display, computer program and mixed reality display device Sirko Pelzl 2024-04-16
8242376 Circuitized substrates utilizing smooth-sided conductive layers as part thereof John M. Lauffer, Voya R. Markovich 2012-08-14
7838776 Circuitized substrates utilizing smooth-sided conductive layers as part thereof John M. Lauffer, Voya R. Markovich 2010-11-23
7383629 Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereof John M. Lauffer, Voya R. Markovich 2008-06-10
7169313 Plating method for circuitized substrates Norman A. Card, Robert D. Edwards, John J. Konrad, Roy H. Magnuson, Timothy L. Wells 2007-01-30
6845557 Method for producing an electronic package possessing controlled impedance characteristics Thomas R. Miller, William J. Rudik, Robert J. Testa, Kevin Unger 2005-01-25
6776852 Process of removing holefill residue from a metallic surface of an electronic substrate Christina M. Boyko, Brian E. Curcio, Donald S. Farquhar 2004-08-17
6630743 Copper plated PTH barrels and methods for fabricating Roy H. Magnuson, Voya R. Markovich, Thomas R. Miller 2003-10-07
6618940 Fine pitch circuitization with filled plated through holes Kenneth J. Lubert, Curtis Miller, Thomas R. Miller, Robert David Sebesta, James Warren Wilson 2003-09-16
6547974 Method of producing fine-line circuit boards using chemical polishing Stanley M. Albrechta, Christina M. Boyko, Kathleen L. Covert, Natalie B. Feilchenfeld, Voya R. Markovich +1 more 2003-04-15
6537608 Protection of a plated through hole from chemical attack Thomas R. Miller, Kristen A. Stauffer 2003-03-25
6469256 Structure for high speed printed wiring boards with multiple differential impedance-controlled layers Thomas R. Miller, William J. Rudik, Robert J. Testa, Kevin Unger 2002-10-22
6467160 Fine pitch circuitization with unfilled plated through holes Michael J. Cummings, Michael V. Longo, Curtis Miller, Thomas R. Miller 2002-10-22
6291779 Fine pitch circuitization with filled plated through holes Kenneth J. Lubert, Curtis Miller, Thomas R. Miller, Robert David Sebesta, James Warren Wilson 2001-09-18
6264851 Selective seed and plate using permanent resist Voya R. Markovich, William E. Wilson 2001-07-24
6241138 Paper web threading apparatus and method for threading a paper web through a papermaking machine Bruce G. Garrigan, Patrick Theut 2001-06-05
6221694 Method of making a circuitized substrate with an aperture Anilkumar C. Bhatt, Michael J. Cummings, Thomas R. Miller, Kristen A. Stauffer 2001-04-24
6188027 Protection of a plated through hole from chemical attack Thomas R. Miller, Kristen A. Stauffer 2001-02-13
6093335 Method of surface finishes for eliminating surface irregularities and defects Ashwinkumar C. Bhatt, John Christopher Camp, Subahu D. Desai, Voya R. Markovich 2000-07-25
5893983 Technique for removing defects from a layer of metal John J. Konrad, Voya R. Markovich, George Frederick Reel, Jose A. Rios, Timothy L. Wells 1999-04-13
5759427 Method and apparatus for polishing metal surfaces Edward Cibulsky, Gerald Kiballa, Voya R. Markovich, Gary L. Newman, John Francis Prikazsky 1998-06-02
5705757 Apparatus and method for measuring torque and power 1998-01-06
5489500 Flexible strip structure for a parallel processor and method of fabricating the flexible strip John Andrejack, Natalie B. Feilchenfeld, David B. Stone, Paul Gerard Wilkin 1996-02-06