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Composite flakes and methods for making and using the same |
Jackie L. Kulfan, Calum H. Munro |
2007-05-29 |
| 7169313 |
Plating method for circuitized substrates |
Norman A. Card, John J. Konrad, Roy H. Magnuson, Timothy L. Wells, Michael Wozniak |
2007-01-30 |
| 6841228 |
Structure having embedded flush circuitry features and method of fabricating |
Jeffrey Alan Knight, Allen F. Moring, James Warren Wilson |
2005-01-11 |
| 6663786 |
Structure having embedded flush circuitry features and method of fabricating |
Jeffrey Alan Knight, Allen F. Moring, James Warren Wilson |
2003-12-16 |
| 6414509 |
Method and apparatus for in-situ testing of integrated circuit chips |
Anilkumar C. Bhatt, Leo Raymond Buda, Paul Joseph Hart, Anthony P. Ingraham, Voya R. Markovich +6 more |
2002-07-02 |
| 6383617 |
Method for electroless gold deposition in the presence of a palladium seeder and article produced thereby |
Gerald L. Ballard, John G. Gaudiello, Voya R. Markovich |
2002-05-07 |
| 6086946 |
Method for electroless gold deposition in the presence of a palladium seeder and article produced thereby |
Gerald L. Ballard, John G. Gaudiello, Voya R. Markovich |
2000-07-11 |
| 5733466 |
Electrolytic method of depositing gold connectors on a printed circuit board |
Biebele Opubo Benebo, Edmund Glenn Benjamin, John J. Konrad, Timothy L. Wells, Jerzy M. Zalesinski |
1998-03-31 |
| 5363553 |
Method of drilling vias and through holes |
Frank D. Egitto, Thomas P. Gall, Paul S. Gursky, David E. Houser, James Steven Kamperman +1 more |
1994-11-15 |
| 4969979 |
Direct electroplating of through holes |
Bernd Karl Appelt, Perminder S. Bindra, James R. Loomis, Jae Man Park, Jonathan D. Reid +2 more |
1990-11-13 |