Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
RE

Robert D. Edwards — 10 Patents

ETEndicott Interconnect Technologies: 1 patents #52 of 87Top 60%
POPpg Industries Ohio: 1 patents #741 of 1,316Top 60%
Vestal, NY: #83 of 481 inventorsTop 20%
New York: #14,754 of 115,490 inventorsTop 15%
Overall (All Time): #481,000 of 4,157,543Top 15%
10 Patents All Time
Robert D. Edwards has been granted 10 US patents while listed as an inventor at Endicott Interconnect Technologies. The first was granted in 1990 and the most recent in May 2007. Robert D. Edwards ranks #481,000 of 4,157,543 US inventors in our database (top 11.6%). Patent records list Robert D. Edwards in Vestal, NY, US.

Patents per Year

Patents granted per year, 1990 to 2007Bar chart with a peak of 2 patents in 2002.peak 21990: 1 patents19901994: 1 patents19941998: 1 patents19982000: 1 patents20002002: 2 patents20022003: 1 patents20032005: 1 patents20052007: 2 patents2007

Issued Patents All Time

Showing 1–10 of 10 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
7223476 Composite flakes and methods for making and using the same Jackie L. Kulfan, Calum H. Munro 2007-05-29 $13,383,000
7169313 Plating method for circuitized substrates Norman A. Card, John J. Konrad, Roy H. Magnuson, Timothy L. Wells, Michael Wozniak 2007-01-30
6841228 Structure having embedded flush circuitry features and method of fabricating Jeffrey Alan Knight, Allen F. Moring, James Warren Wilson 2005-01-11 $11,104,000
6663786 Structure having embedded flush circuitry features and method of fabricating Jeffrey Alan Knight, Allen F. Moring, James Warren Wilson 2003-12-16 $6,455,000
6414509 Method and apparatus for in-situ testing of integrated circuit chips Anilkumar C. Bhatt, Leo Raymond Buda, Paul Joseph Hart, Anthony P. Ingraham, Voya R. Markovich +6 more 2002-07-02 $11,850,000
6383617 Method for electroless gold deposition in the presence of a palladium seeder and article produced thereby Gerald L. Ballard, John G. Gaudiello, Voya R. Markovich 2002-05-07 $13,479,000
6086946 Method for electroless gold deposition in the presence of a palladium seeder and article produced thereby Gerald L. Ballard, John G. Gaudiello, Voya R. Markovich 2000-07-11 $21,738,000
5733466 Electrolytic method of depositing gold connectors on a printed circuit board Biebele Opubo Benebo, Edmund Glenn Benjamin, John J. Konrad, Timothy L. Wells, Jerzy M. Zalesinski 1998-03-31 $13,730,000
5363553 Method of drilling vias and through holes Frank D. Egitto, Thomas P. Gall, Paul S. Gursky, David E. Houser, James Steven Kamperman +1 more 1994-11-15 $18,665,000
4969979 Direct electroplating of through holes Bernd Karl Appelt, Perminder S. Bindra, James R. Loomis, Jae Man Park, Jonathan D. Reid +2 more 1990-11-13 $12,818,000