Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7223476 | Composite flakes and methods for making and using the same | Jackie L. Kulfan, Calum H. Munro | 2007-05-29 |
| 7169313 | Plating method for circuitized substrates | Norman A. Card, John J. Konrad, Roy H. Magnuson, Timothy L. Wells, Michael Wozniak | 2007-01-30 |
| 6841228 | Structure having embedded flush circuitry features and method of fabricating | Jeffrey Alan Knight, Allen F. Moring, James Warren Wilson | 2005-01-11 |
| 6663786 | Structure having embedded flush circuitry features and method of fabricating | Jeffrey Alan Knight, Allen F. Moring, James Warren Wilson | 2003-12-16 |
| 6414509 | Method and apparatus for in-situ testing of integrated circuit chips | Anilkumar C. Bhatt, Leo Raymond Buda, Paul Joseph Hart, Anthony P. Ingraham, Voya R. Markovich +6 more | 2002-07-02 |
| 6383617 | Method for electroless gold deposition in the presence of a palladium seeder and article produced thereby | Gerald L. Ballard, John G. Gaudiello, Voya R. Markovich | 2002-05-07 |
| 6086946 | Method for electroless gold deposition in the presence of a palladium seeder and article produced thereby | Gerald L. Ballard, John G. Gaudiello, Voya R. Markovich | 2000-07-11 |
| 5733466 | Electrolytic method of depositing gold connectors on a printed circuit board | Biebele Opubo Benebo, Edmund Glenn Benjamin, John J. Konrad, Timothy L. Wells, Jerzy M. Zalesinski | 1998-03-31 |
| 5363553 | Method of drilling vias and through holes | Frank D. Egitto, Thomas P. Gall, Paul S. Gursky, David E. Houser, James Steven Kamperman +1 more | 1994-11-15 |
| 4969979 | Direct electroplating of through holes | Bernd Karl Appelt, Perminder S. Bindra, James R. Loomis, Jae Man Park, Jonathan D. Reid +2 more | 1990-11-13 |