NC

Norman A. Card

ET Endicott Interconnect Technologies: 6 patents #21 of 87Top 25%
IBM: 4 patents #21,733 of 70,183Top 35%
Overall (All Time): #517,212 of 4,157,543Top 15%
10
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8493173 Method of cavity forming on a buried resistor layer using a fusion bonding process Ashwinkumar C. Bhatt, Charles Buchter 2013-07-23
8288266 Circuitized substrate assembly Richard A. Day, John J. Konrad 2012-10-16
7910156 Method of making circuitized substrate with selected conductors having solder thereon Robert J. Harendza, John J. Konrad, Tonya L. Mosher, Susan Pitely, Jose A. Rios 2011-03-22
7547577 Method of making circuitized substrate with solder paste connections Thomas R. Miller, William J. Rudik 2009-06-16
7211470 Method and apparatus for depositing conductive paste in circuitized substrate openings John M. Lauffer 2007-05-01
7169313 Plating method for circuitized substrates Robert D. Edwards, John J. Konrad, Roy H. Magnuson, Timothy L. Wells, Michael Wozniak 2007-01-30
6485892 Method for masking a hole in a substrate during plating Lawrence Robert Blumberg, Richard A. Day, Stephen Joseph Fuerniss, John J. Konrad, Jeffrey McKeveny +1 more 2002-11-26
6349871 Process for reworking circuit boards James M. Ergler, James D. Herard, Paul R. Kasperek, Richard S. McKinley, Der-jin Woan 2002-02-26
6216938 Machine and process for reworking circuit boards James M. Ergler, James D. Herard, Paul R. Kasperek, Richard S. McKinley, Der-jin Woan 2001-04-17
5300402 Composition for photo imaging Richard A. Day, Donald Herman Glatzel, David J. Russell 1994-04-05