CB

Charles Buchter

ET Endicott Interconnect Technologies: 1 patents #52 of 87Top 60%
Overall (All Time): #3,168,201 of 4,157,543Top 80%
1
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8493173 Method of cavity forming on a buried resistor layer using a fusion bonding process Ashwinkumar C. Bhatt, Norman A. Card 2013-07-23