RH

Robert J. Harendza

ET Endicott Interconnect Technologies: 2 patents #35 of 87Top 45%
Overall (All Time): #2,104,455 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7910156 Method of making circuitized substrate with selected conductors having solder thereon Norman A. Card, John J. Konrad, Tonya L. Mosher, Susan Pitely, Jose A. Rios 2011-03-22
7596863 Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein Ashwinkumar C. Bhatt, Robert M. Japp 2009-10-06