Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11972425 | Systems and methods for account verification | Daniel David, Christina Zikeli, Kellie L. Thomas, Todd Klapprodt, Loftlon Worth | 2024-04-30 |
| 7098136 | Structure having flush circuit features and method of making | Ronald Clothier, Robert David Sebesta | 2006-08-29 |
| 6841228 | Structure having embedded flush circuitry features and method of fabricating | Robert D. Edwards, Allen F. Moring, James Warren Wilson | 2005-01-11 |
| 6815709 | Structure having flush circuitry features and method of making | Ronald Clothier, Robert David Sebesta | 2004-11-09 |
| 6663786 | Structure having embedded flush circuitry features and method of fabricating | Robert D. Edwards, Allen F. Moring, James Warren Wilson | 2003-12-16 |
| 6576549 | Fabrication of a metalized blind via | Frank D. Egitto, Elizabeth Foster, Raymond T. Galasco, David E. Houser, Mark L. Janecek +7 more | 2003-06-10 |
| 6529379 | Article exhibiting enhanced adhesion between a dielectric substrate and heat spreader and method | James W. Fuller | 2003-03-04 |
| 6522014 | Fabrication of a metalized blind via | Frank D. Egitto, Elizabeth Foster, Raymond T. Galasco, David E. Houser, Mark L. Janecek +7 more | 2003-02-18 |
| 6351030 | Electronic package utilizing protective coating | Ross Downey Havens, Robert M. Japp, Mark D. Poliks, Anne Marie Quinn | 2002-02-26 |
| 6038137 | Chip carrier having a chip mounted on an organic dielectric substrate overlaid with a photoimageable dielectric having circuitry thereon | Ashwinkumar C. Bhatt, Subahu D. Desai, Thomas P. Duffy | 2000-03-14 |
| 5888850 | Method for providing a protective coating and electronic package utilizing same | Ross Downey Havens, Robert M. Japp, Mark D. Poliks, Anne Marie Quinn | 1999-03-30 |
| 5869356 | Method and structure for constraining the flow of incapsulant applied to an I/C chip on a substrate | James W. Fuller, Mary Beth Fletcher, Joseph Alphonse Kotylo, David Michael Passante, Allen F. Moring | 1999-02-09 |
| 5817405 | Circuitized substrate with same surface conductors of different resolutions | Anikumar Chinuprasad Bhatt, Ashwinkumar C. Bhatt, Robert Jeffrey Day, Thomas P. Duffy, Richard William Malek +1 more | 1998-10-06 |
| 5798909 | Single-tiered organic chip carriers for wire bond-type chips | Ashwinkumar C. Bhatt, Subahu D. Desai, Thomas P. Duffy | 1998-08-25 |
| 5784260 | Structure for constraining the flow of encapsulant applied to an I/C chip on a substrate | James W. Fuller, Mary Beth Fletcher, Joseph Alphonse Kotylo, David Michael Passante, Allen F. Moring | 1998-07-21 |
| 5724232 | Chip carrier having an organic photopatternable material and a metal substrate | Ashwinkumar C. Bhatt, Subahu D. Desai, Thomas P. Duffy | 1998-03-03 |
| 5707893 | Method of making a circuitized substrate using two different metallization processes | Anilkumar C. Bhatt, Ashwinkumar C. Bhatt, Robert Jeffrey Day, Thomas P. Duffy, Richard William Malek +1 more | 1998-01-13 |
| 5566448 | Method of construction for multi-tiered cavities used in laminate carriers | Ashwinkumar C. Bhatt, Thomas P. Duffy, James P. Walsh | 1996-10-22 |
| 5281150 | Method and apparatus for connecting cable to the surface of printed circuit boards or the like | Edward G. Bundga, Michael D. Dinardo, Louis J. Konrad, III | 1994-01-25 |