Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6841228 | Structure having embedded flush circuitry features and method of fabricating | Robert D. Edwards, Jeffrey Alan Knight, James Warren Wilson | 2005-01-11 |
| 6663786 | Structure having embedded flush circuitry features and method of fabricating | Robert D. Edwards, Jeffrey Alan Knight, James Warren Wilson | 2003-12-16 |
| 6225028 | Method of making an enhanced organic chip carrier package | Anilkumar C. Bhatt, Thomas R. Miller, James P. Walsh | 2001-05-01 |
| 6207354 | Method of making an organic chip carrier package | Anilkumar C. Bhatt, Thomas R. Miller, James P. Walsh | 2001-03-27 |
| 6178093 | Information handling system with circuit assembly having holes filled with filler material | Anilkumar C. Bhatt, Donald Herman Glatzel, Voya R. Markovich, Kostas Papathomas, David J. Russell | 2001-01-23 |
| 6138350 | Process for manufacturing a circuit board with filled holes | Anilkumar C. Bhatt, Donald Herman Glatzel, Voya R. Markovich, Kostas Papathomas, David J. Russell | 2000-10-31 |
| 6127025 | Circuit board with wiring sealing filled holes | Anilkumar C. Bhatt, Donald Herman Glatzel, Voya R. Markovich, Kostas Papathomas, David J. Russell | 2000-10-03 |
| 6114019 | Circuit board assemblies having filled vias free from bleed-out | Anilkumar C. Bhatt, Donald Herman Glatzel, Voya R. Markovich, Kostas Papathomas, David J. Russell | 2000-09-05 |
| 6110650 | Method of making a circuitized substrate | Anilkumar C. Bhatt, Thomas R. Miller, James P. Walsh | 2000-08-29 |
| 6000129 | Process for manufacturing a circuit with filled holes | Anilkumar C. Bhatt, Donald Herman Glatzel, Voya R. Markovich, Kostas Papathomas, David J. Russell | 1999-12-14 |
| 5953594 | Method of making a circuitized substrate for chip carrier structure | Anilkumar C. Bhatt, Thomas R. Miller, James P. Walsh | 1999-09-14 |
| 5869356 | Method and structure for constraining the flow of incapsulant applied to an I/C chip on a substrate | James W. Fuller, Mary Beth Fletcher, Joseph Alphonse Kotylo, Jeffrey Alan Knight, David Michael Passante | 1999-02-09 |
| 5822856 | Manufacturing circuit board assemblies having filled vias | Anilkumar C. Bhatt, Donald Herman Glatzel, Voya R. Markovich, Kostas Papathomas, David J. Russell | 1998-10-20 |
| 5784260 | Structure for constraining the flow of encapsulant applied to an I/C chip on a substrate | James W. Fuller, Mary Beth Fletcher, Joseph Alphonse Kotylo, Jeffrey Alan Knight, David Michael Passante | 1998-07-21 |
| 4786528 | Process for treating reinforced polymer composite | William J. Amelio, Voya R. Markovich, William J. McCarthy, Peter A. Moschak, Douglas H. Strope | 1988-11-22 |