Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5421507 | Au-Sn transient liquid bonding in high performance laminates | Charles R. Davis, Richard Hsiao, Jae Man Park, Jonathan D. Reid | 1995-06-06 |
| 5403420 | Fabrication tool and method for parallel processor structure and package | Thomas P. Gall, David B. Stone, Cheryl L. Tytran, James R. Wilcox | 1995-04-04 |
| 5379193 | Parallel processor structure and package | Thomas P. Gall | 1995-01-03 |
| 5280414 | Au-Sn transient liquid bonding in high performance laminates | Charles R. Davis, Richard Hsiao, Jae Man Park, Jonathan D. Reid | 1994-01-18 |
| 4969979 | Direct electroplating of through holes | Bernd Karl Appelt, Perminder S. Bindra, Robert D. Edwards, Jae Man Park, Jonathan D. Reid +2 more | 1990-11-13 |
| 4960634 | Epoxy composition of increased thermal conductivity and use thereof | Christina M. Boyko, Craig N. Johnston, Carl Samuelson, Ricahrd A. Schumacher | 1990-10-02 |