| 9798259 |
Electrostatic ink compositions, methods and print substrates |
Alexey S. Kabalnov, Guang Jin Li, Yaron Grinwald, Reut Avigdor |
2017-10-24 |
| 8596746 |
Inkjet pen/printhead with shipping fluid |
Chorng Ing Sow, Alexey S. Kabalnov |
2013-12-03 |
| 8474934 |
Method for improving gloss of a print |
Joshua A. Mann, Dustin Blair, Glenn Thomas Haddick, Thomas Jeffrey Winter |
2013-07-02 |
| 8356878 |
Method of printing images |
Kai-Kong Iu, Ryan Tung Vu |
2013-01-22 |
| 8267498 |
Methods, apparatus and articles of manufacture to control gloss quality |
Dustin Blair, David S. Vejtasa, Glenn Thomas Haddick |
2012-09-18 |
| 7914110 |
Purging fluid from fluid-ejection nozzles by performing spit-wipe operations |
Jeffrey J. Anderson, Cynthia Jarom, Jeffrey D. Rutland |
2011-03-29 |
| 7402254 |
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements |
Donald S. Farquhar, Konstantinos I. Papathomas, Mark D. Poliks |
2008-07-22 |
| 7303639 |
Method for producing Z-axis interconnection assembly of printed wiring board elements |
Donald S. Farquhar, Lisa J. Jimarez, Keith P. Brodock |
2007-12-04 |
| 7076869 |
Solid via layer to layer interconnect |
Donald S. Farquhar, Voya R. Markovich, Konstantinos I. Papathomas |
2006-07-18 |
| 6969436 |
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements |
Donald S. Farquhar, Lisa J. Jimarez, Keith P. Brodock |
2005-11-29 |
| 6955849 |
Method and structure for small pitch z-axis electrical interconnections |
Frank D. Egitto, Robert M. Japp, Thomas R. Miller, Manh-Quan Nguyen, Douglas O. Powell |
2005-10-18 |
| 6790305 |
Method and structure for small pitch z-axis electrical interconnections |
Frank D. Egitto, Robert M. Japp, Thomas R. Miller, Manh-Quan Nguyen, Douglas O. Powell |
2004-09-14 |
| 6776852 |
Process of removing holefill residue from a metallic surface of an electronic substrate |
Christina M. Boyko, Donald S. Farquhar, Michael Wozniak |
2004-08-17 |
| 6645607 |
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements |
Donald S. Farquhar, Konstantinos I. Papathomas, Mark D. Poliks |
2003-11-11 |
| 6638607 |
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements |
Donald S. Farquhar, Lisa J. Jimarez, Keith P. Brodock |
2003-10-28 |
| 6634543 |
Method of forming metallic z-interconnects for laminate chip packages and boards |
Donald S. Farquhar, Elizabeth Foster, Amit K. Sarkhel |
2003-10-21 |
| 6581280 |
Method for filling high aspect ratio via holes in electronic substrates |
Peter A. Gruber, Frederic Maurer, Konstantinos I. Papathomas, Mark D. Poliks |
2003-06-24 |
| 6570102 |
Structure for high speed printed wiring boards with multiple differential impedance-controlled layer |
Thomas R. Miller, Konstantinos I. Papathomas, Joseph J. Sniezek |
2003-05-27 |
| 6504111 |
Solid via layer to layer interconnect |
Donald S. Farquhar, Voya R. Markovich, Konstantinos I. Papathomas |
2003-01-07 |
| 6465084 |
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements |
Donald S. Farquhar, Konstantinos I. Papathomas, Mark D. Poliks |
2002-10-15 |
| 6452117 |
Method for filling high aspect ratio via holes in electronic substrates and the resulting holes |
Peter A. Gruber, Frederic Maurer, Konstantinos I. Papathomas, Mark D. Poliks |
2002-09-17 |
