Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9798259 | Electrostatic ink compositions, methods and print substrates | Alexey S. Kabalnov, Guang Jin Li, Yaron Grinwald, Reut Avigdor | 2017-10-24 |
| 8596746 | Inkjet pen/printhead with shipping fluid | Chorng Ing Sow, Alexey S. Kabalnov | 2013-12-03 |
| 8474934 | Method for improving gloss of a print | Joshua A. Mann, Dustin Blair, Glenn Thomas Haddick, Thomas Jeffrey Winter | 2013-07-02 |
| 8356878 | Method of printing images | Kai-Kong Iu, Ryan Tung Vu | 2013-01-22 |
| 8267498 | Methods, apparatus and articles of manufacture to control gloss quality | Dustin Blair, David S. Vejtasa, Glenn Thomas Haddick | 2012-09-18 |
| 7914110 | Purging fluid from fluid-ejection nozzles by performing spit-wipe operations | Jeffrey J. Anderson, Cynthia Jarom, Jeffrey D. Rutland | 2011-03-29 |
| 7402254 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements | Donald S. Farquhar, Konstantinos I. Papathomas, Mark D. Poliks | 2008-07-22 |
| 7303639 | Method for producing Z-axis interconnection assembly of printed wiring board elements | Donald S. Farquhar, Lisa J. Jimarez, Keith P. Brodock | 2007-12-04 |
| 7076869 | Solid via layer to layer interconnect | Donald S. Farquhar, Voya R. Markovich, Konstantinos I. Papathomas | 2006-07-18 |
| 6969436 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements | Donald S. Farquhar, Lisa J. Jimarez, Keith P. Brodock | 2005-11-29 |
| 6955849 | Method and structure for small pitch z-axis electrical interconnections | Frank D. Egitto, Robert M. Japp, Thomas R. Miller, Manh-Quan Nguyen, Douglas O. Powell | 2005-10-18 |
| 6790305 | Method and structure for small pitch z-axis electrical interconnections | Frank D. Egitto, Robert M. Japp, Thomas R. Miller, Manh-Quan Nguyen, Douglas O. Powell | 2004-09-14 |
| 6776852 | Process of removing holefill residue from a metallic surface of an electronic substrate | Christina M. Boyko, Donald S. Farquhar, Michael Wozniak | 2004-08-17 |
| 6645607 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements | Donald S. Farquhar, Konstantinos I. Papathomas, Mark D. Poliks | 2003-11-11 |
| 6638607 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements | Donald S. Farquhar, Lisa J. Jimarez, Keith P. Brodock | 2003-10-28 |
| 6634543 | Method of forming metallic z-interconnects for laminate chip packages and boards | Donald S. Farquhar, Elizabeth Foster, Amit K. Sarkhel | 2003-10-21 |
| 6581280 | Method for filling high aspect ratio via holes in electronic substrates | Peter A. Gruber, Frederic Maurer, Konstantinos I. Papathomas, Mark D. Poliks | 2003-06-24 |
| 6570102 | Structure for high speed printed wiring boards with multiple differential impedance-controlled layer | Thomas R. Miller, Konstantinos I. Papathomas, Joseph J. Sniezek | 2003-05-27 |
| 6504111 | Solid via layer to layer interconnect | Donald S. Farquhar, Voya R. Markovich, Konstantinos I. Papathomas | 2003-01-07 |
| 6465084 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements | Donald S. Farquhar, Konstantinos I. Papathomas, Mark D. Poliks | 2002-10-15 |
| 6452117 | Method for filling high aspect ratio via holes in electronic substrates and the resulting holes | Peter A. Gruber, Frederic Maurer, Konstantinos I. Papathomas, Mark D. Poliks | 2002-09-17 |