Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and structure for small pitch z-axis electrical interconnections

Method and structure for small pitch z-axis electrical interconnections

US Patent 6955849 · Granted Oct 18, 2005

Estimated economic value: $9,308,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Reduced-warpage laminate structure2020
Electrostatic ink compositions, methods and print substrates2017
Copper feature design for warpage control of substrates2017
Reduced-warpage laminate structure2017
Reduced-warpage laminate structure2017
Sacrificial carrier dicing of semiconductor wafers2016
Sacrificial carrier dicing of semiconductor wafers2016
Coreless layer buildup structure with LGA and joining layer2016
Copper feature design for warpage control of substrates2015
Construction of reliable stacked via in electronic substrates—vertical stiffness2015
Construction of reliable stacked via in electronic substrates—vertical stiffness2014
Reducing impedance discontinuity in packages2014