| 6931722 |
Method of fabricating printed circuit board with mixed metallurgy pads |
Edward Lee Arrington, Anilkumar C. Bhatt, Edmond O. Fey, Kevin Knadle, John J. Konrad +5 more |
2005-08-23 |
| 6784086 |
Lead-free solder structure and method for high fatigue life |
Sudipta K. Ray |
2004-08-31 |
| 6634543 |
Method of forming metallic z-interconnects for laminate chip packages and boards |
Brian E. Curcio, Donald S. Farquhar, Elizabeth Foster |
2003-10-21 |
| 6586683 |
Printed circuit board with mixed metallurgy pads and method of fabrication |
Edward Lee Arrington, Anilkumar C. Bhatt, Edmond O. Fey, Kevin Knadle, John J. Konrad +5 more |
2003-07-01 |
| 6581821 |
Electronic package interconnect structure comprising lead-free solders |
— |
2003-06-24 |
| 6545229 |
Method for producing circuit board assemblies using surface mount components with finely spaced leads |
Bao MA, Ping Kwong Seto |
2003-04-08 |
| 6492715 |
Integrated semiconductor package |
Voya R. Markovich, Douglas O. Powell |
2002-12-10 |
| 6437254 |
Apparatus and method for printed circuit board repair |
Alan Harris Crudo, John G. Davis, Christian Robert Le Coz, Mark V. Pierson, Ajit K. Trivedi |
2002-08-20 |
| 6433425 |
Electronic package interconnect structure comprising lead-free solders |
— |
2002-08-13 |
| 6429388 |
High density column grid array connections and method thereof |
Mario J. Interrante, Brenda Peterson, Sudipta K. Ray, William E. Sablinski |
2002-08-06 |
| 6295724 |
Apparatus for printed circuit board repair |
Alan Harris Crudo, John G. Davis, Christian Robert Le Coz, Mark V. Pierson, Ajit K. Trivedi |
2001-10-02 |
| 6281581 |
Substrate structure for improving attachment reliability of semiconductor chips and modules |
Kishor Desai |
2001-08-28 |
| 6251766 |
Method for improving attachment reliability of semiconductor chips and modules |
Kishor Desai |
2001-06-26 |
| 6167615 |
Method for producing circuit board assemblies using surface mount components with finely spaced leads |
Bao MA, Ping Kwong Seto |
2001-01-02 |
| 6115912 |
Apparatus and method for printed circuit board repair |
Alan Harris Crudo, John G. Davis, Christian Robert Le Coz, Mark V. Pierson, Ajit K. Trivedi |
2000-09-12 |
| 6018866 |
Apparatus and method for printed circuit board repair |
Alan Harris Crudo, John G. Davis, Christian Robert Le Coz, Mark V. Pierson, Ajit K. Trivedi |
2000-02-01 |
| 6010060 |
Lead-free solder process |
Charles G. Woychik |
2000-01-04 |
| 6002172 |
Substrate structure and method for improving attachment reliability of semiconductor chips and modules |
Kishor Desai |
1999-12-14 |
| 5874043 |
Lead-free, high tin ternary solder alloy of tin, silver, and indium |
Charles G. Woychik |
1999-02-23 |
| 5809641 |
Method for printed circuit board repair |
Alan Harris Crudo, John G. Davis, Christian Robert Le Coz, Mark V. Pierson, Ajit K. Trivedi |
1998-09-22 |
| 5742483 |
Method for producing circuit board assemblies using surface mount components with finely spaced leads |
Bao MA, Ping Kwong Seto |
1998-04-21 |
| 5730932 |
Lead-free, tin-based multi-component solder alloys |
Charles G. Woychik |
1998-03-24 |
| 5729440 |
Solder hierarchy for chip attachment to substrates |
Miguel A. Jimarez, Lawrence H. White |
1998-03-17 |
| 5655703 |
Solder hierarchy for chip attachment to substrates |
Miguel A. Jimarez, Lawrence H. White |
1997-08-12 |
