JD

John G. Davis

IBM: 21 patents #5,175 of 70,183Top 8%
UN Unknown: 2 patents #12,644 of 83,584Top 20%
PU Princeton University: 1 patents #543 of 1,197Top 50%
LM Lockheed Martin: 1 patents #2,805 of 6,507Top 45%
Overall (All Time): #175,283 of 4,157,543Top 5%
24
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8053683 Equipment container retention and bonding system and method Douglas A. Slocum, Jamey Kelsall, John Arthur Stubecki 2011-11-08
7735652 Apparatus and method for continuous particle separation David William Inglis, Robert H. Austin, James C. Sturm 2010-06-15
7645410 Thermoplastic adhesive preform for heat sink attachment Michael A. Gaynes, Joseph D. Poole 2010-01-12
7150096 Universal tool for uniformly applying a force to a plurality of components on a circuit board James Westcott Heater, Allen Thomas Mays 2006-12-19
6893591 Thermoplastic adhesive preform for heat sink attachment Michael A. Gaynes, Joseph D. Poole 2005-05-17
6589376 Method and composition for mounting an electronic component and device formed therewith Joseph D. Poole, Kris A. Slesinger, Michael C. Weller 2003-07-08
6590285 Method and composition for mounting an electronic component and device formed therewith Joseph D. Poole, Kris A. Slesinger, Michael C. Weller 2003-07-08
6471117 Transfer fluxing method and apparatus for component placement on substrate Allen Thomas Mays, Kris A. Slesinger 2002-10-29
6437254 Apparatus and method for printed circuit board repair Alan Harris Crudo, Christian Robert Le Coz, Mark V. Pierson, Amit K. Sarkhel, Ajit K. Trivedi 2002-08-20
6432511 Thermoplastic adhesive preform for heat sink attachment Michael A. Gaynes, Joseph D. Poole 2002-08-13
6332267 Process of manufacturing a removably interlockable assembly Richard Joseph Noreika, Michael C. Weller 2001-12-25
6295724 Apparatus for printed circuit board repair Alan Harris Crudo, Christian Robert Le Coz, Mark V. Pierson, Amit K. Sarkhel, Ajit K. Trivedi 2001-10-02
6296173 Method and apparatus for soldering ball grid array modules to substrates Joseph Michael Kielbasa 2001-10-02
6196444 Method and apparatus for soldering ball grid array modules to substrates Joseph Michael Kielbasa 2001-03-06
6179625 Removable interlockable first and second connectors having engaging flexible members and process of making same Richard Joseph Noreika, Michael C. Weller 2001-01-30
6141866 Universal tool for uniformly applying a force to a plurality of components on a circuit board James Westcott Heater, Allen Thomas Mays 2000-11-07
6115912 Apparatus and method for printed circuit board repair Alan Harris Crudo, Christian Robert Le Coz, Mark V. Pierson, Amit K. Sarkhel, Ajit K. Trivedi 2000-09-12
6043110 Wire mesh insert for thermal adhesives Michael A. Gaynes, Joseph D. Poole 2000-03-28
6039805 Transfer fluxing method and apparatus for component placement on substrate Allen Thomas Mays, Kris A. Slesinger 2000-03-21
6018866 Apparatus and method for printed circuit board repair Alan Harris Crudo, Christian Robert Le Coz, Mark V. Pierson, Amit K. Sarkhel, Ajit K. Trivedi 2000-02-01
5940687 Wire mesh insert for thermal adhesives Michael A. Gaynes, Joseph D. Poole 1999-08-17
5924622 Method and apparatus for soldering ball grid array modules to substrates Joseph Michael Kielbasa 1999-07-20
5809641 Method for printed circuit board repair Alan Harris Crudo, Christian Robert Le Coz, Mark V. Pierson, Amit K. Sarkhel, Ajit K. Trivedi 1998-09-22
4254898 Particle spacing and metering device 1981-03-10