Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7645410 | Thermoplastic adhesive preform for heat sink attachment | John G. Davis, Michael A. Gaynes | 2010-01-12 |
| 6893591 | Thermoplastic adhesive preform for heat sink attachment | John G. Davis, Michael A. Gaynes | 2005-05-17 |
| 6664794 | Apparatus and method for evaluating the surface insulation resistance of electronic assembly manufacture | Charles David Fieselman, Richard Joseph Noreika | 2003-12-16 |
| 6589376 | Method and composition for mounting an electronic component and device formed therewith | John G. Davis, Kris A. Slesinger, Michael C. Weller | 2003-07-08 |
| 6590285 | Method and composition for mounting an electronic component and device formed therewith | John G. Davis, Kris A. Slesinger, Michael C. Weller | 2003-07-08 |
| 6530412 | Surface mount technology with masked cure | John Cronin, Michael C. Weller | 2003-03-11 |
| 6499644 | Rework and underfill nozzle for electronic components | Wilton L. Cox, Kris A. Slesinger | 2002-12-31 |
| 6464125 | Rework and underfill nozzle for electronic components | Wilton L. Cox, Kris A. Slesinger | 2002-10-15 |
| 6457631 | Rework and underfill nozzle for electronic components | Wilton L. Cox, Kris A. Slesinger | 2002-10-01 |
| 6432511 | Thermoplastic adhesive preform for heat sink attachment | John G. Davis, Michael A. Gaynes | 2002-08-13 |
| 6264094 | Rework and underfill nozzle for electronic components | Wilton L. Cox, Kris A. Slesinger | 2001-07-24 |
| 6220503 | Rework and underfill nozzle for electronic components | Wilton L. Cox, Kris A. Slesinger | 2001-04-24 |
| 6139661 | Two step SMT method using masked cure | John Cronin, Michael C. Weller | 2000-10-31 |
| 6054720 | Apparatus and method for evaluating the surface insulation resistance of electronic assembly manufacture | Charles David Fieselman, Richard Joseph Noreika | 2000-04-25 |
| 6043110 | Wire mesh insert for thermal adhesives | John G. Davis, Michael A. Gaynes | 2000-03-28 |
| 5940687 | Wire mesh insert for thermal adhesives | John G. Davis, Michael A. Gaynes | 1999-08-17 |
| 5932031 | Fluorescent water soluble solder flux | Mark R. Hamilton, Marc V. Malone, Charles J. Merz, III | 1999-08-03 |
| 5820697 | Fluorescent water soluble solder flux | Mark R. Hamilton, Marc V. Malone, Charles J. Merz, III | 1998-10-13 |
| 5394609 | Method and apparatus for manufacture of printed circuit cards | Mark Ferguson, Kenneth J. Guskie, Leon S. Nguyen, Stuart L. Young, Simon Yu | 1995-03-07 |
| 5340013 | Rework process for printed circuit cards and solder fountain having gas blanket for carrying out the process | Frank P. Zickefoose | 1994-08-23 |
| 5190595 | Ozone safe stripping solution for thermal grease | Joseph G. Ameen, Joseph Funari, David W. Sissenstein, Jr. | 1993-03-02 |