| 6070785 |
Process for manufacturing boards that can accept a pluggable tab module that can be attached or removed without solder |
Joseph G. Ameen, Michael John Funari |
2000-06-06 |
$33,361,000 |
| 5920125 |
Interconnection of a carrier substrate and a semiconductor device |
James V. Ellerson, Jack A. Varcoe |
1999-07-06 |
$40,075,000 |
| 5907903 |
Multi-layer-multi-chip pyramid and circuit board structure and method of forming same |
Joseph G. Ameen |
1999-06-01 |
$35,326,000 |
| 5859470 |
Interconnection of a carrier substrate and a semiconductor device |
James V. Ellerson, Jack A. Varcoe |
1999-01-12 |
$24,935,000 |
| 5744759 |
Circuit boards that can accept a pluggable tab module that can be attached or removed without solder |
Joseph G. Ameen, Michael John Funari |
1998-04-28 |
$8,659,000 |
| 5715144 |
Multi-layer, multi-chip pyramid and circuit board structure |
Joseph G. Ameen |
1998-02-03 |
$15,523,000 |
| 5565119 |
Method and apparatus for soldering with a multiple tip and associated optical fiber heating device |
John R. Behun, Pedro A. Chalco, J. Robert Young |
1996-10-15 |
$13,145,000 |
| 5553769 |
Interconnection of a carrier substrate and a semiconductor device |
James V. Ellerson, Jack A. Varcoe |
1996-09-10 |
$12,851,000 |
| 5435732 |
Flexible circuit member |
Christopher G. Angulas, Patrick T. Flynn, Thomas E. Kindl, Randy L. Orr |
1995-07-25 |
$11,735,000 |
| 5321884 |
Multilayered flexible circuit package |
Joseph G. Ameen, David W. Sissenstein, Jr. |
1994-06-21 |
$13,003,000 |
| 5261155 |
Method for bonding flexible circuit to circuitized substrate to provide electrical connection therebetween using different solders |
Christopher G. Angulas, Patrick T. Flynn, Thomas E. Kindl, Randy L. Orr |
1993-11-16 |
$9,129,000 |
| 5241454 |
Mutlilayered flexible circuit package |
Joseph G. Ameen, David W. Sissenstein, Jr. |
1993-08-31 |
$6,793,000 |
| 5222649 |
Apparatus for soldering a semiconductor device to a circuitized substrate |
Ronald J. Moore |
1993-06-29 |
$12,051,000 |
| 5211328 |
Method of applying solder |
Joseph G. Ameen, Ronald J. Moore |
1993-05-18 |
$11,046,000 |
| 5207372 |
Method for soldering a semiconductor device to a circuitized substrate |
Ronald J. Moore |
1993-05-04 |
$10,309,000 |
| 5203075 |
Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders |
Christopher G. Angulas, Patrick T. Flynn, Thomas E. Kindl, Randy L. Orr |
1993-04-20 |
$8,588,000 |
| 5190595 |
Ozone safe stripping solution for thermal grease |
Joseph G. Ameen, Joseph D. Poole, David W. Sissenstein, Jr. |
1993-03-02 |
$8,547,000 |
| 5115964 |
Method for bonding thin film electronic device |
Joseph G. Ameen, John A. Goldfuss, Jr. |
1992-05-26 |
$13,293,000 |
| 5109318 |
Pluggable electronic circuit package assembly with snap together heat sink housing |
Terence C. Godown, Scott Reynolds, Bahgat Sammakia |
1992-04-28 |
$11,441,000 |
| 5057969 |
Thin film electronic device |
Joseph G. Ameen, John A. Goldfuss, Jr. |
1991-10-15 |
$13,216,000 |
| 5028984 |
Epoxy composition and use thereof |
Joseph G. Ameen, Bahgat Sammakia, David W. Sissenstein, Jr., Samuel L. Smey |
1991-07-02 |
$16,319,000 |
| 5003429 |
Electronic assembly with enhanced heat sinking |
Don L. Baker, William F. Otto, Bahgat Sammakia, Randall J. Stutzman |
1991-03-26 |
$18,949,000 |
| 4849856 |
Electronic package with improved heat sink |
Mary C. Green, Scott Reynolds, Bahgat Sammakia |
1989-07-18 |
$10,899,000 |
| 4670325 |
Structure containing a layer consisting of a polyimide and an organic filled and method for producing such a structure |
Peter Bakos, Russell E. Darrow, Nelson P. Franchak |
1987-06-02 |
$51,580,000 |
| 4434134 |
Pinned ceramic substrate |
Russell E. Darrow, George S. Kotrch, George C. Phillips |
1984-02-28 |
$19,635,000 |
