Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6070785 | Process for manufacturing boards that can accept a pluggable tab module that can be attached or removed without solder | Joseph G. Ameen, Michael John Funari | 2000-06-06 |
| 5920125 | Interconnection of a carrier substrate and a semiconductor device | James V. Ellerson, Jack A. Varcoe | 1999-07-06 |
| 5907903 | Multi-layer-multi-chip pyramid and circuit board structure and method of forming same | Joseph G. Ameen | 1999-06-01 |
| 5859470 | Interconnection of a carrier substrate and a semiconductor device | James V. Ellerson, Jack A. Varcoe | 1999-01-12 |
| 5744759 | Circuit boards that can accept a pluggable tab module that can be attached or removed without solder | Joseph G. Ameen, Michael John Funari | 1998-04-28 |
| 5715144 | Multi-layer, multi-chip pyramid and circuit board structure | Joseph G. Ameen | 1998-02-03 |
| 5565119 | Method and apparatus for soldering with a multiple tip and associated optical fiber heating device | John R. Behun, Pedro A. Chalco, J. Robert Young | 1996-10-15 |
| 5553769 | Interconnection of a carrier substrate and a semiconductor device | James V. Ellerson, Jack A. Varcoe | 1996-09-10 |
| 5435732 | Flexible circuit member | Christopher G. Angulas, Patrick T. Flynn, Thomas E. Kindl, Randy L. Orr | 1995-07-25 |
| 5321884 | Multilayered flexible circuit package | Joseph G. Ameen, David W. Sissenstein, Jr. | 1994-06-21 |
| 5261155 | Method for bonding flexible circuit to circuitized substrate to provide electrical connection therebetween using different solders | Christopher G. Angulas, Patrick T. Flynn, Thomas E. Kindl, Randy L. Orr | 1993-11-16 |
| 5241454 | Mutlilayered flexible circuit package | Joseph G. Ameen, David W. Sissenstein, Jr. | 1993-08-31 |
| 5222649 | Apparatus for soldering a semiconductor device to a circuitized substrate | Ronald J. Moore | 1993-06-29 |
| 5211328 | Method of applying solder | Joseph G. Ameen, Ronald J. Moore | 1993-05-18 |
| 5207372 | Method for soldering a semiconductor device to a circuitized substrate | Ronald J. Moore | 1993-05-04 |
| 5203075 | Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders | Christopher G. Angulas, Patrick T. Flynn, Thomas E. Kindl, Randy L. Orr | 1993-04-20 |
| 5190595 | Ozone safe stripping solution for thermal grease | Joseph G. Ameen, Joseph D. Poole, David W. Sissenstein, Jr. | 1993-03-02 |
| 5115964 | Method for bonding thin film electronic device | Joseph G. Ameen, John A. Goldfuss, Jr. | 1992-05-26 |
| 5109318 | Pluggable electronic circuit package assembly with snap together heat sink housing | Terence C. Godown, Scott Reynolds, Bahgat Sammakia | 1992-04-28 |
| 5057969 | Thin film electronic device | Joseph G. Ameen, John A. Goldfuss, Jr. | 1991-10-15 |
| 5028984 | Epoxy composition and use thereof | Joseph G. Ameen, Bahgat Sammakia, David W. Sissenstein, Jr., Samuel L. Smey | 1991-07-02 |
| 5003429 | Electronic assembly with enhanced heat sinking | Don L. Baker, William F. Otto, Bahgat Sammakia, Randall J. Stutzman | 1991-03-26 |
| 4849856 | Electronic package with improved heat sink | Mary C. Green, Scott Reynolds, Bahgat Sammakia | 1989-07-18 |
| 4670325 | Structure containing a layer consisting of a polyimide and an organic filled and method for producing such a structure | Peter Bakos, Russell E. Darrow, Nelson P. Franchak | 1987-06-02 |
| 4434134 | Pinned ceramic substrate | Russell E. Darrow, George S. Kotrch, George C. Phillips | 1984-02-28 |