| 5674595 |
Coverlay for printed circuit boards |
Raymond A. Busacco, Paul George Rickerl |
1997-10-07 |
| 5166037 |
Method of additive circuitization of circuit boards with high adhesion, voidless copper leads |
John M. Atkinson, John D. Larnerd, Ronald J. Moore |
1992-11-24 |
| 4676426 |
Solder leveling technique |
Alan J. Emerick, John D. Larnerd |
1987-06-30 |
| 4670325 |
Structure containing a layer consisting of a polyimide and an organic filled and method for producing such a structure |
Peter Bakos, Nelson P. Franchak, Joseph Funari |
1987-06-02 |
| 4550493 |
Apparatus for connecting contact pins to a substrate |
Glenn J. Ingraham, John D. Larnerd, Robert W. Nesky |
1985-11-05 |
| 4434134 |
Pinned ceramic substrate |
Joseph Funari, George S. Kotrch, George C. Phillips |
1984-02-28 |
| 4392617 |
Spray head apparatus |
Peter Bakos, Joseph Funari, Diane L. Redpath |
1983-07-12 |
| 4294729 |
Composition containing alcohol and use thereof for epoxy removal |
Peter Bakos, Joseph Funari, Richard M. Poliak |
1981-10-13 |
| 4276186 |
Cleaning composition and use thereof |
Peter Bakos, Gerald A. Bendz, Dennis L. Rivenburgh |
1981-06-30 |
| 4246147 |
Screenable and strippable solder mask and use thereof |
Peter Bakos, Dennis L. Rivenburgh, William F. Williams |
1981-01-20 |
| 4233620 |
Sealing of integrated circuit modules |
Irving Memis, Richard M. Poliak |
1980-11-11 |
