Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5166037 | Method of additive circuitization of circuit boards with high adhesion, voidless copper leads | John M. Atkinson, Russell E. Darrow, Ronald J. Moore | 1992-11-24 |
| 4676426 | Solder leveling technique | Russell E. Darrow, Alan J. Emerick | 1987-06-30 |
| 4550493 | Apparatus for connecting contact pins to a substrate | Russell E. Darrow, Glenn J. Ingraham, Robert W. Nesky | 1985-11-05 |