Issued Patents All Time
Showing 25 most recent of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8144480 | Multi-layer embedded capacitance and resistance substrate core | Rabindra N. Das, John M. Lauffer, Steven G. Rosser | 2012-03-27 |
| 7886435 | High performance chip carrier substrate | Jean Audet | 2011-02-15 |
| 7863526 | High performance chip carrier substrate | Jean Audet | 2011-01-04 |
| 7791897 | Multi-layer embedded capacitance and resistance substrate core | Rabindra N. Das, John M. Lauffer, Steven G. Rosser | 2010-09-07 |
| 7622384 | Method of making multi-chip electronic package with reduced line skew | — | 2009-11-24 |
| 7589283 | Method of making circuitized substrate with improved impedance control circuitry, electrical assembly and information handling system | Charles E. Danoski, Steven G. Rosser | 2009-09-15 |
| 7470990 | Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same | Robert M. Japp, Kostas Papathomas | 2008-12-30 |
| 7454833 | High performance chip carrier substrate | Jean Audet | 2008-11-25 |
| 7416972 | Method of making same low moisture absorptive circuitized substrave with reduced thermal expansion | Robert M. Japp, Kostas Papathomas | 2008-08-26 |
| 7332818 | Multi-chip electronic package with reduced line skew and circuitized substrate for use therein | — | 2008-02-19 |
| 7294791 | Circuitized substrate with improved impedance control circuitry, method of making same, electrical assembly and information handling system utilizing same | Charles E. Danoski, Steven G. Rosser | 2007-11-13 |
| 7279798 | High wireability microvia substrate | — | 2007-10-09 |
| 7214886 | High performance chip carrier substrate | Jean Audet | 2007-05-08 |
| 7145221 | Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same | Kostas Papathomas | 2006-12-05 |
| 7119003 | Extension of fatigue life for C4 solder ball to chip connection | William E. Bernier, Charles F. Carey, Eberhard Gramatzki, Thomas R. Homa, Eric A. Johnson +3 more | 2006-10-10 |
| 7067916 | Extension of fatigue life for C4 solder ball to chip connection | William E. Bernier, Charles F. Carey, Eberhard Gramatzki, Thomas R. Homa, Eric A. Johnson +3 more | 2006-06-27 |
| 6965170 | High wireability microvia substrate | — | 2005-11-15 |
| 6919635 | High density microvia substrate with high wireability | Kazushige Kawasaki | 2005-07-19 |
| 6664485 | Full additive process with filled plated through holes | Anilkumar C. Bhatt, Voya R. Markovich, William E. Wilson | 2003-12-16 |
| 6650016 | Selective C4 connection in IC packaging | Stephen W. MacQuarrie | 2003-11-18 |
| 6418616 | Full additive process with filled plated through holes | Anilkumar C. Bhatt, Voya R. Markovich, William E. Wilson | 2002-07-16 |
| 6391210 | Process for manufacturing a multi-layer circuit board | Bernd Karl Appelt, John M. Lauffer, Voya R. Markovich, David J. Russell | 2002-05-21 |
| 6290860 | Process for design and manufacture of fine line circuits on planarized thin film dielectrics and circuits manufactured thereby | Bernd Karl Appelt, John M. Lauffer, Voya R. Markovich, David J. Russell | 2001-09-18 |
| 6251707 | Attaching heat sinks directly to flip chips and ceramic chip carriers | William E. Bernier, Michael A. Gaynes, Hussain Shaukatuallah | 2001-06-26 |
| 6195883 | Full additive process with filled plated through holes | Anilkumar C. Bhatt, Voya R. Markovich, William E. Wilson | 2001-03-06 |