Issued Patents All Time
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6162997 | Circuit board with primary and secondary through holes | — | 2000-12-19 |
| 6069023 | Attaching heat sinks directly to flip chips and ceramic chip carriers | William E. Bernier, Michael A. Gaynes, Hussain Shaukatuallah | 2000-05-30 |
| 5965944 | Printed circuit boards for mounting a semiconductor integrated circuit die | Edward Jay Frankoski | 1999-10-12 |
| 5847929 | Attaching heat sinks directly to flip chips and ceramic chip carriers | William E. Bernier, Michael A. Gaynes, Hussain Shaukatuallah | 1998-12-08 |
| 5532024 | Method for improving the adhesion of polymeric adhesives to nickel surfaces | Steven F. Arndt, Luis J. Matienzo, James Spalik, Tien Y. Wu | 1996-07-02 |
| 5414928 | Method of making an electronic package assembly with protective encapsulant material | Barry A. Bonitz, James V. Ellerson, Kishen N. Kapur, Jack M. McCreary, Gerald M. Vettel | 1995-05-16 |
| 5189261 | Electrical and/or thermal interconnections and methods for obtaining such | Lawrence C. Alexander, Bernd Karl Appelt, David K. Balkin, James Jens Hansen, Joseph Hromek +5 more | 1993-02-23 |
| 4971894 | Method and structure for preventing wet etchant penetration at the interface between a resist mask and an underlying metal layer | Frederick M. Rovente | 1990-11-20 |
| 4233620 | Sealing of integrated circuit modules | Russell E. Darrow, Richard M. Poliak | 1980-11-11 |