Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5880590 | Apparatus and method for burn-in and testing of devices with solder bumps or preforms | Kishor Desai | 1999-03-09 |
| 5189261 | Electrical and/or thermal interconnections and methods for obtaining such | Lawrence C. Alexander, Bernd Karl Appelt, David K. Balkin, James Jens Hansen, Ronald A. Kaschak +5 more | 1993-02-23 |