| 7737550 |
Optimization of electronic package geometry for thermal dissipation |
Scott P. Moore |
2010-06-15 |
| 6650016 |
Selective C4 connection in IC packaging |
Irving Memis |
2003-11-18 |
| 6576549 |
Fabrication of a metalized blind via |
Frank D. Egitto, Elizabeth Foster, Raymond T. Galasco, David E. Houser, Mark L. Janecek +7 more |
2003-06-10 |
| 6522014 |
Fabrication of a metalized blind via |
Frank D. Egitto, Elizabeth Foster, Raymond T. Galasco, David E. Houser, Mark L. Janecek +7 more |
2003-02-18 |
| 6438830 |
Process of producing plastic pin grid array |
Eric P. Dibble, Eric H. Laine |
2002-08-27 |
| 6373703 |
Integral design features for heatsink attach for electronic packages |
Eric A. Johnson, Stephen J. Kosteva |
2002-04-16 |
| 6212076 |
Enhanced heat-dissipating printed circuit board package |
Randall J. Stutzman, Jerzy M. Zalesinski |
2001-04-03 |
| 6150716 |
Metal substrate having an IC chip and carrier mounting |
Wayne R. Storr, James Warren Wilson |
2000-11-21 |
| 6131278 |
Metal substrate having an IC chip and carrier mounting |
Wayne R. Storr, James Warren Wilson |
2000-10-17 |
| 6107121 |
Method of making interconnections between a multi-layer chip stack to a printed circuit board in a ceramic package |
Steven Joel Diffenderfer |
2000-08-22 |
| 5969947 |
Integral design features for heatsink attach for electronic packages |
Eric A. Johnson, Stephen J. Kosteva |
1999-10-19 |
| 5952716 |
Pin attach structure for an electronic package |
Eric P. Dibble, Eric H. Laine |
1999-09-14 |
| 5872397 |
Semiconductor device package including a thick integrated circuit chip stack |
Steven Joel Diffenderfer |
1999-02-16 |
