Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8314500 | Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers | Luc Belanger, Stephen L. Buchwalter, Leena Paivikki Buchwalter, Ajay P. Giri, Jonathan H. Griffith +8 more | 2012-11-20 |
| 7932169 | Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers | Luc Belanger, Stephen L. Buchwalter, Leena Paivikki Buchwalter, Ajay P. Giri, Jonathan H. Griffith +8 more | 2011-04-26 |
| 6438830 | Process of producing plastic pin grid array | Eric P. Dibble, Stephen W. MacQuarrie | 2002-08-27 |
| 5952716 | Pin attach structure for an electronic package | Eric P. Dibble, Stephen W. MacQuarrie | 1999-09-14 |
| 5939783 | Electronic package | James Warren Wilson | 1999-08-17 |
| 5751060 | Electronic package | James Warren Wilson | 1998-05-12 |
| 5728606 | Electronic Package | James Warren Wilson | 1998-03-17 |
| 5616958 | Electronic package | James Warren Wilson | 1997-04-01 |