Eric P. Dibble — 8 Patents at IBM

Eric P. Dibble has been granted 8 US patents while listed as an inventor at IBM. The first was granted in 1983 and the most recent in August 2002. Eric P. Dibble ranks #600,572 of 4,157,543 US inventors in our database (top 14.4%). Patent records list Eric P. Dibble in Endicott, NY, US.

Issued Patents All Time

Showing 1–8 of 8 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
6438830	Process of producing plastic pin grid array	Eric H. Laine, Stephen W. MacQuarrie	2002-08-27	$8,564,000
6040631	Method of improved cavity BGA circuit package	Eric A. Johnson, Raymond Phillips	2000-03-21	$35,798,000
5952716	Pin attach structure for an electronic package	Eric H. Laine, Stephen W. MacQuarrie	1999-09-14	$25,256,000
5316788	Applying solder to high density substrates	Steven L. Hanakovic, Voya R. Markovich, Daniel S. Niedrich, Gary Paul Vlasak, Richard Stuart Zarr +1 more	1994-05-31	$5,696,000
4976626	Connector for connecting flexible film circuit carrier to board or card	Alan D. Knight	1990-12-11	$53,133,000
4849079	Process for preparing low electrical contact resistance composition	Jerome J. Cuomo, Solomon L. Levine	1989-07-18	$10,899,000
4774151	Low contact electrical resistant composition, substrates coated therewith, and process for preparing such	Jerome J. Cuomo, Solomon L. Levine	1988-09-27	$36,783,000
4409071	Masking for selective electroplating jet method	Thomas E. Lynch	1983-10-11	$50,794,000

Eric P. Dibble — 8 Patents

Issued Patents All Time

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