| 6438830 |
Process of producing plastic pin grid array |
Eric H. Laine, Stephen W. MacQuarrie |
2002-08-27 |
| 6040631 |
Method of improved cavity BGA circuit package |
Eric A. Johnson, Raymond Phillips |
2000-03-21 |
| 5952716 |
Pin attach structure for an electronic package |
Eric H. Laine, Stephen W. MacQuarrie |
1999-09-14 |
| 5316788 |
Applying solder to high density substrates |
Steven L. Hanakovic, Voya R. Markovich, Daniel S. Niedrich, Gary Paul Vlasak, Richard Stuart Zarr +1 more |
1994-05-31 |
| 4976626 |
Connector for connecting flexible film circuit carrier to board or card |
Alan D. Knight |
1990-12-11 |
| 4849079 |
Process for preparing low electrical contact resistance composition |
Jerome J. Cuomo, Solomon L. Levine |
1989-07-18 |
| 4774151 |
Low contact electrical resistant composition, substrates coated therewith, and process for preparing such |
Jerome J. Cuomo, Solomon L. Levine |
1988-09-27 |
| 4409071 |
Masking for selective electroplating jet method |
Thomas E. Lynch |
1983-10-11 |
