Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 6107121 | Method of making interconnections between a multi-layer chip stack to a printed circuit board in a ceramic package | Stephen W. MacQuarrie | 2000-08-22 | $30,771,000 |
| 5872397 | Semiconductor device package including a thick integrated circuit chip stack | Stephen W. MacQuarrie | 1999-02-16 | $10,802,000 |
| 5814877 | Single layer leadframe design with groundplane capability | Hussain Shaukatullah | 1998-09-29 | $18,461,000 |
| 5639694 | Method for making single layer leadframe having groundplane capability | Hussain Shaukatullah | 1997-06-17 | $15,640,000 |
| 5543657 | Single layer leadframe design with groundplane capability | Hussain Shaukatullah | 1996-08-06 | $6,901,000 |