Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6107121 | Method of making interconnections between a multi-layer chip stack to a printed circuit board in a ceramic package | Stephen W. MacQuarrie | 2000-08-22 |
| 5872397 | Semiconductor device package including a thick integrated circuit chip stack | Stephen W. MacQuarrie | 1999-02-16 |
| 5814877 | Single layer leadframe design with groundplane capability | Hussain Shaukatullah | 1998-09-29 |
| 5639694 | Method for making single layer leadframe having groundplane capability | Hussain Shaukatullah | 1997-06-17 |
| 5543657 | Single layer leadframe design with groundplane capability | Hussain Shaukatullah | 1996-08-06 |