| 6697037 |
TFT LCD active data line repair |
Paul M. Alt, Bruce K. Furman, Raymond R. Horton, Chandrasekhar Narayan, Benal Lee Owens, Jr. +2 more |
2004-02-24 |
| 6444562 |
Nickel alloy films for reduced intermetallic formation in solder |
Edmund Blackshear |
2002-09-03 |
| 6130479 |
Nickel alloy films for reduced intermetallic formation in solder |
Edmund Blackshear |
2000-10-10 |
| 6029881 |
Micro-scale part positioning by surface interlocking |
Bruce K. Furman, Raymond R. Horton, Chandrasekhar Narayan |
2000-02-29 |
| 5948286 |
Diffusion bonding of lead interconnections using precise laser-thermosonic energy |
Raymond R. Horton, Chandrasekhar Narayan, Michael J. Palmer |
1999-09-07 |
| 5826328 |
Method of making a thin radio frequency transponder |
Michael John Brady, Francois Guindon, Paul A. Moskowitz, Philip Murphy |
1998-10-27 |
| 5565119 |
Method and apparatus for soldering with a multiple tip and associated optical fiber heating device |
John R. Behun, Joseph Funari, J. Robert Young |
1996-10-15 |
| 5457299 |
Semiconductor chip packaging method which heat cures an encapsulant deposited on a chip using a laser beam to heat the back side of the chip |
Claude Blais |
1995-10-10 |
| 5321886 |
Applying conductive lines to integrated circuits |
Matthew F. Cali, Laertis Economikos, James L. Speidell |
1994-06-21 |
| 5310967 |
Applying conductive lines to integrated circuits |
Matthew F. Cali, Laertis Economikos, James L. Speidell |
1994-05-10 |
| 5298715 |
Lasersonic soldering of fine insulated wires to heat-sensitive substrates |
Wesley L. Hillman, Richard Kurth, Nicholas T. Panousis |
1994-03-29 |
| 5289632 |
Applying conductive lines to integrated circuits |
Matthew F. Cali, Laertis Economikos, James L. Speidell |
1994-03-01 |
| 5281025 |
Temperature sensing device for dynamically measuring temperature fluctuation in a tip of a bonding device |
Matthew F. Cali |
1994-01-25 |
| 5154022 |
High precision micromachining of very fine features |
Harry D. Euler, Robert L. Rohr |
1992-10-13 |
| 5079070 |
Repair of open defects in thin film conductors |
Carlos J. Sambucetti |
1992-01-07 |
| 4970365 |
Method and apparatus for bonding components leads to pads located on a non-rigid substrate |
— |
1990-11-13 |
| 4894509 |
Laser assisted heater bar for multiple lead attachment |
Joseph C. Andreshak |
1990-01-16 |
