Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6697037 | TFT LCD active data line repair | Paul M. Alt, Bruce K. Furman, Raymond R. Horton, Chandrasekhar Narayan, Benal Lee Owens, Jr. +2 more | 2004-02-24 |
| 6444562 | Nickel alloy films for reduced intermetallic formation in solder | Edmund Blackshear | 2002-09-03 |
| 6130479 | Nickel alloy films for reduced intermetallic formation in solder | Edmund Blackshear | 2000-10-10 |
| 6029881 | Micro-scale part positioning by surface interlocking | Bruce K. Furman, Raymond R. Horton, Chandrasekhar Narayan | 2000-02-29 |
| 5948286 | Diffusion bonding of lead interconnections using precise laser-thermosonic energy | Raymond R. Horton, Chandrasekhar Narayan, Michael J. Palmer | 1999-09-07 |
| 5826328 | Method of making a thin radio frequency transponder | Michael John Brady, Francois Guindon, Paul A. Moskowitz, Philip Murphy | 1998-10-27 |
| 5565119 | Method and apparatus for soldering with a multiple tip and associated optical fiber heating device | John R. Behun, Joseph Funari, J. Robert Young | 1996-10-15 |
| 5457299 | Semiconductor chip packaging method which heat cures an encapsulant deposited on a chip using a laser beam to heat the back side of the chip | Claude Blais | 1995-10-10 |
| 5321886 | Applying conductive lines to integrated circuits | Matthew F. Cali, Laertis Economikos, James L. Speidell | 1994-06-21 |
| 5310967 | Applying conductive lines to integrated circuits | Matthew F. Cali, Laertis Economikos, James L. Speidell | 1994-05-10 |
| 5298715 | Lasersonic soldering of fine insulated wires to heat-sensitive substrates | Wesley L. Hillman, Richard Kurth, Nicholas T. Panousis | 1994-03-29 |
| 5289632 | Applying conductive lines to integrated circuits | Matthew F. Cali, Laertis Economikos, James L. Speidell | 1994-03-01 |
| 5281025 | Temperature sensing device for dynamically measuring temperature fluctuation in a tip of a bonding device | Matthew F. Cali | 1994-01-25 |
| 5154022 | High precision micromachining of very fine features | Harry D. Euler, Robert L. Rohr | 1992-10-13 |
| 5079070 | Repair of open defects in thin film conductors | Carlos J. Sambucetti | 1992-01-07 |
| 4970365 | Method and apparatus for bonding components leads to pads located on a non-rigid substrate | — | 1990-11-13 |
| 4894509 | Laser assisted heater bar for multiple lead attachment | Joseph C. Andreshak | 1990-01-16 |