Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7771541 | Method of removing metallic, inorganic and organic contaminants from chip passivation layer surfaces | Eric Duchesne, Kang-Wook Lee, Sylvain Ouimet, Gerald J. Scilla | 2010-08-10 |
| 6904673 | Control of flux by ink stop line in chip joining | Julie Nadeau Filteau, Pierre Langevin, Robert L. Toutant, Alain Warren | 2005-06-14 |
| 6112976 | Method of manufacturing wire segments of homogeneous composition | Louis-Marie Achard, David Danovitch, Jean-Francois Garneau, Michel Robert | 2000-09-05 |
| 5457299 | Semiconductor chip packaging method which heat cures an encapsulant deposited on a chip using a laser beam to heat the back side of the chip | Pedro A. Chalco | 1995-10-10 |