Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211262 | Electronic apparatus having inter-chip stiffener | Tuhin Sinha, Steven P. Ostrander, Bhupender Singh | 2021-12-28 |
| 10615511 | Antenna packaging solution | Jean Labonte | 2020-04-07 |
| 10374322 | Antenna packaging solution | Jean Labonte | 2019-08-06 |
| 9219051 | Laminate peripheral clamping to control microelectronic module BSM warpage | Stephanie Allard, Martin Beaumier, Jean-Francois Drapeau, Jean Labonte, Steven P. Ostrander | 2015-12-22 |
| 8559474 | Silicon carrier optoelectronic packaging | Paul S. Andry, Russell A. Budd, Bing Dang, David Danovitch, Benjamin V. Fasano +4 more | 2013-10-15 |
| 8421217 | Achieving mechanical and thermal stability in a multi-chip package | Jon A. Casey, John Saunders Corbin, Jr., David Danovitch, Isabelle Depatie, Virendra R. Jadhav +4 more | 2013-04-16 |
| 8290008 | Silicon carrier optoelectronic packaging | Paul S. Andry, Russell A. Budd, Bing Dang, David Danovitch, Benjamin V. Fasano +4 more | 2012-10-16 |
| 8202765 | Achieving mechanical and thermal stability in a multi-chip package | Jon A. Casey, John Saunders Corbin, Jr., David Danovitch, Isabelle Depatie, Virendra R. Jadhav +4 more | 2012-06-19 |
| 7771541 | Method of removing metallic, inorganic and organic contaminants from chip passivation layer surfaces | Claude Blais, Eric Duchesne, Kang-Wook Lee, Gerald J. Scilla | 2010-08-10 |
| 7498198 | Structure and method for stress reduction in flip chip microelectronic packages using underfill materials with spatially varying properties | Sylvie Charles, David Danovitch, Julien Sylvestre | 2009-03-03 |
| 6946746 | Method to reduce number of wire-bond loop heights versus the total quantity of power and signal rings | Frederic Beaulieu, Mark J. Kuzawinski, Stephane Mainville, Jean-Guy Quintal, Guy Robichaud | 2005-09-20 |
| 6737296 | Method to reduce number of wire-bond loop heights versus the total quantity of power and signal rings | Frederic Beaulieu, Mark J. Kuzawinski, Stephane Mainville, Jean-Guy Quintal, Guy Robichaud | 2004-05-18 |
| 6605526 | Wirebond passivation pad connection using heated capillary | Wayne J. Howell, Ronald L. Mendelson, William T. Motsiff, Jean-Guy Quintal | 2003-08-12 |
| 6414386 | Method to reduce number of wire-bond loop heights versus the total quantity of power and signal rings | Frederic Beaulieu, Mark J. Kuzawinski, Stephane Mainville, Jean-Guy Quintal, Guy Robichaud | 2002-07-02 |
| 6137158 | Leadframe and leadframe assembly for parallel optical computer link | Mitchell S. Cohen, Marco Gauvin, Glen Walden Johnson, Daniel M. Kuchta, Andre Lacerte +4 more | 2000-10-24 |
| 5781682 | Low-cost packaging for parallel optical computer link | Mitchell S. Cohen, Marco Gauvin, Glen Walden Johnson, Daniel M. Kuchta, Andre Lacerte +4 more | 1998-07-14 |