Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6946746 | Method to reduce number of wire-bond loop heights versus the total quantity of power and signal rings | Frederic Beaulieu, Mark J. Kuzawinski, Stephane Mainville, Sylvain Ouimet, Guy Robichaud | 2005-09-20 |
| 6737296 | Method to reduce number of wire-bond loop heights versus the total quantity of power and signal rings | Frederic Beaulieu, Mark J. Kuzawinski, Stephane Mainville, Sylvain Ouimet, Guy Robichaud | 2004-05-18 |
| 6605526 | Wirebond passivation pad connection using heated capillary | Wayne J. Howell, Ronald L. Mendelson, William T. Motsiff, Sylvain Ouimet | 2003-08-12 |
| 6414386 | Method to reduce number of wire-bond loop heights versus the total quantity of power and signal rings | Frederic Beaulieu, Mark J. Kuzawinski, Stephane Mainville, Sylvain Ouimet, Guy Robichaud | 2002-07-02 |