Frederic Beaulieu — 7 Patents at IBM

Frederic Beaulieu has been granted 7 US patents while listed as an inventor at IBM. The first was granted in 2002 and the most recent in September 2013. Frederic Beaulieu ranks #680,018 of 4,157,543 US inventors in our database (top 16.4%). Patent records list Frederic Beaulieu in Brossard, QC, CA.

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Showing 1–7 of 7 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
8524596	Techniques for improving bond pad performance	Gobinda Das, Steven J. Duda, Matthew J. Farinelli, Adreanne Kelly, Samuel McKnight +1 more	2013-09-03	$4,698,000
7696631	Wire bonding personalization and discrete component attachment on wirebond pads	Mukta G. Farooq, Kevin S. Petrarca	2010-04-13	$5,309,000
7273804	Internally reinforced bond pads	David Angell, Takashi Hisada, Adreanne Kelly, Samuel McKnight, Hiromitsu Miyai +4 more	2007-09-25	$7,894,000
6946746	Method to reduce number of wire-bond loop heights versus the total quantity of power and signal rings	Mark J. Kuzawinski, Stephane Mainville, Sylvain Ouimet, Jean-Guy Quintal, Guy Robichaud	2005-09-20	$5,282,000
6864578	Internally reinforced bond pads	David Angell, Takashi Hisada, Adreanne Kelly, Samuel McKnight, Hiromitsu Miyai +4 more	2005-03-08	$6,470,000
6737296	Method to reduce number of wire-bond loop heights versus the total quantity of power and signal rings	Mark J. Kuzawinski, Stephane Mainville, Sylvain Ouimet, Jean-Guy Quintal, Guy Robichaud	2004-05-18	$9,414,000
6414386	Method to reduce number of wire-bond loop heights versus the total quantity of power and signal rings	Mark J. Kuzawinski, Stephane Mainville, Sylvain Ouimet, Jean-Guy Quintal, Guy Robichaud	2002-07-02	$11,850,000

Frederic Beaulieu — 7 Patents

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