Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8524596 | Techniques for improving bond pad performance | Gobinda Das, Steven J. Duda, Matthew J. Farinelli, Adreanne Kelly, Samuel McKnight +1 more | 2013-09-03 |
| 7696631 | Wire bonding personalization and discrete component attachment on wirebond pads | Mukta G. Farooq, Kevin S. Petrarca | 2010-04-13 |
| 7273804 | Internally reinforced bond pads | David Angell, Takashi Hisada, Adreanne Kelly, Samuel McKnight, Hiromitsu Miyai +4 more | 2007-09-25 |
| 6946746 | Method to reduce number of wire-bond loop heights versus the total quantity of power and signal rings | Mark J. Kuzawinski, Stephane Mainville, Sylvain Ouimet, Jean-Guy Quintal, Guy Robichaud | 2005-09-20 |
| 6864578 | Internally reinforced bond pads | David Angell, Takashi Hisada, Adreanne Kelly, Samuel McKnight, Hiromitsu Miyai +4 more | 2005-03-08 |
| 6737296 | Method to reduce number of wire-bond loop heights versus the total quantity of power and signal rings | Mark J. Kuzawinski, Stephane Mainville, Sylvain Ouimet, Jean-Guy Quintal, Guy Robichaud | 2004-05-18 |
| 6414386 | Method to reduce number of wire-bond loop heights versus the total quantity of power and signal rings | Mark J. Kuzawinski, Stephane Mainville, Sylvain Ouimet, Jean-Guy Quintal, Guy Robichaud | 2002-07-02 |