Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7915732 | Production of integrated circuit chip packages prohibiting formation of micro solder balls | Stephen P. Ayotte, Jeffrey D. Gilbert, David John Hill, Timothy M. Sullivan | 2011-03-29 |
| 7134933 | Wafer thickness control during backside grind | Donald W. Brouillette, Thomas G. Ference, Harold G. Linde, Michael S. Hibbs | 2006-11-14 |
| 6915795 | Method and system for dicing wafers, and semiconductor structures incorporating the products thereof | Donald W. Brouillette, Robert F. Cook, Thomas G. Ference, Wayne J. Howell, Eric G. Liniger | 2005-07-12 |
| 6887126 | Wafer thickness control during backside grind | Donald W. Brouillette, Thomas G. Ference, Harold G. Linde, Michael S. Hibbs | 2005-05-03 |
| 6806578 | Copper pad structure | Wayne J. Howell, William T. Motsiff | 2004-10-19 |
| 6605526 | Wirebond passivation pad connection using heated capillary | Wayne J. Howell, William T. Motsiff, Jean-Guy Quintal, Sylvain Ouimet | 2003-08-12 |
| 6600213 | Semiconductor structure and package including a chip having chamfered edges | Donald W. Brouillette, Robert F. Cook, Thomas G. Ference, Wayne J. Howell, Eric G. Liniger | 2003-07-29 |
| 6368881 | Wafer thickness control during backside grind | Donald W. Brouillette, Thomas G. Ference, Harold G. Linde, Michael S. Hibbs | 2002-04-09 |
| 6271102 | Method and system for dicing wafers, and semiconductor structures incorporating the products thereof | Donald W. Brouillette, Robert F. Cook, Thomas G. Ference, Wayne J. Howell, Eric G. Liniger | 2001-08-07 |
| 6222145 | Mechanical strength die sorting | Robert F. Cook, Eric G. Liniger, Dean R. Sanders | 2001-04-24 |
| 6171873 | Method and apparatus for preventing chip breakage during semiconductor manufacturing using wafer grinding striation information | Robert F. Cook, David Frederick Diefenderfer, Eric G. Liniger, John Blondin, Donald W. Brouillette | 2001-01-09 |
| 6153536 | Method for mounting wafer frame at back side grinding (BSG) tool | Donald W. Brouillette | 2000-11-28 |
| 6022791 | Chip crack stop | Robert F. Cook, Eric G. Liniger, Richard Charles Whiteside | 2000-02-08 |
| 5888838 | Method and apparatus for preventing chip breakage during semiconductor manufacturing using wafer grinding striation information | Robert F. Cook, David Frederick Diefenderfer, Eric G. Liniger, John Blondin, Donald W. Brouillette | 1999-03-30 |