Issued Patents All Time
Showing 25 most recent of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11075619 | Contactless readable programmable transponder to monitor chip join | Shawn P. Fetterolf, Adam J. McPadden, Timothy M. Sullivan | 2021-07-27 |
| 10605850 | Screening methodology to eliminate wire sweep in bond and assembly module packaging | Michael Russell Uy Gonzales, Mark Tiam Weng Lam | 2020-03-31 |
| 10601404 | Contactless readable programmable transponder to monitor chip join | Shawn P. Fetterolf, Adam J. McPadden, Timothy M. Sullivan | 2020-03-24 |
| 10429414 | Multiple contact probe head disassembly method and system | Marvin Montaque, David L. Gardell | 2019-10-01 |
| 10309884 | Predicting semiconductor package warpage | Eric G. Liniger, Travis S. Longenbach | 2019-06-04 |
| 10256204 | Separation of integrated circuit structure from adjacent chip | Glen E. Richard, Hanyi Ding | 2019-04-09 |
| 10245667 | Chip joining by induction heating | Glen E. Richard, Timothy D. Sullivan, Timothy M. Sullivan | 2019-04-02 |
| 10200016 | Contactless readable programmable transponder to monitor chip join | Shawn P. Fetterolf, Adam J. McPadden, Timothy M. Sullivan | 2019-02-05 |
| 10050012 | Method for semiconductor die removal rework | Glen E. Richard, Timothy M. Sullivan | 2018-08-14 |
| 9876487 | Contactless readable programmable transponder to monitor chip join | Shawn P. Fetterolf, Adam J. McPadden, Timothy M. Sullivan | 2018-01-23 |
| 9776270 | Chip joining by induction heating | Glen E. Richard, Timothy D. Sullivan, Timothy M. Sullivan | 2017-10-03 |
| 9772268 | Predicting semiconductor package warpage | Eric G. Liniger, Travis S. Longenbach | 2017-09-26 |
| 9711422 | Visually detecting electrostatic discharge events | David John Hill, John Thomas Kinnear, Jr., Glen E. Richard, Timothy M. Sullivan, Heather M. Truax | 2017-07-18 |
| 9704830 | Semiconductor structure and method of making | Glen E. Richard, Timothy M. Sullivan | 2017-07-11 |
| 9645573 | Reliability monitor test strategy definition | Petra U. Klinger-Park, Mark T.W. Lam, Sanda S. Myat, Glen E. Richard | 2017-05-09 |
| 9548275 | Detecting sudden changes in acceleration in semiconductor device or semiconductor packaging containing semiconductor device | Benjamin J. Pierce, Timothy M. Sullivan, Heather M. Truax | 2017-01-17 |
| 9508680 | Induction heating for underfill removal and chip rework | Glen E. Richard, Timothy M. Sullivan | 2016-11-29 |
| 9470740 | Screening methodology to eliminate wire sweep in bond and assembly module packaging | Michael Russell Uy Gonzales, Mark Tiam Weng Lam | 2016-10-18 |
| 9472490 | IC structure with recessed solder bump area and methods of forming same | Timothy M. Sullivan, Glen E. Richard, Timothy D. Sullivan | 2016-10-18 |
| 9230921 | Self-healing crack stop structure | Alissa R. Cote, Kendra A. Lyons, John C. Malinowski, Benjamin J. Pierce | 2016-01-05 |
| 9222707 | Temperature stabilization in semiconductors using the magnetocaloric effect | Nicholas G. Clore, Michael C. Johnson | 2015-12-29 |
| 9190375 | Solder bump reflow by induction heating | Sébastien S. Quesnel, Glen E. Richard, Timothy D. Sullivan, Timothy M. Sullivan | 2015-11-17 |
| 9177931 | Reducing thermal energy transfer during chip-join processing | Sébastien S. Quesnel, Glen E. Richard, Timothy D. Sullivan, Timothy M. Sullivan | 2015-11-03 |
| 9105573 | Visually detecting electrostatic discharge events | David John Hill, John Thomas Kinnear, Jr., Glen E. Richard, Timothy M. Sullivan, Heather M. Truax | 2015-08-11 |
| 9059097 | Inhibiting propagation of imperfections in semiconductor devices | David John Hill, Glen E. Richard, Timothy M. Sullivan, Heather M. Truax | 2015-06-16 |