Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9875985 | Flip-chip bonder with induction coils and a heating element | Jae-Woong Nah, Katsuyuki Sakuma | 2018-01-23 |
| 9190375 | Solder bump reflow by induction heating | Stephen P. Ayotte, Glen E. Richard, Timothy D. Sullivan, Timothy M. Sullivan | 2015-11-17 |
| 9177931 | Reducing thermal energy transfer during chip-join processing | Stephen P. Ayotte, Glen E. Richard, Timothy D. Sullivan, Timothy M. Sullivan | 2015-11-03 |