| 10256204 |
Separation of integrated circuit structure from adjacent chip |
Stephen P. Ayotte, Hanyi Ding |
2019-04-09 |
$34,923,000 |
| 10245667 |
Chip joining by induction heating |
Stephen P. Ayotte, Timothy D. Sullivan, Timothy M. Sullivan |
2019-04-02 |
$24,341,000 |
| 10050012 |
Method for semiconductor die removal rework |
Stephen P. Ayotte, Timothy M. Sullivan |
2018-08-14 |
$4,051,000 |
| 9776270 |
Chip joining by induction heating |
Stephen P. Ayotte, Timothy D. Sullivan, Timothy M. Sullivan |
2017-10-03 |
$10,070,000 |
| 9711422 |
Visually detecting electrostatic discharge events |
Stephen P. Ayotte, David John Hill, John Thomas Kinnear, Jr., Timothy M. Sullivan, Heather M. Truax |
2017-07-18 |
$11,753,000 |
| 9704830 |
Semiconductor structure and method of making |
Stephen P. Ayotte, Timothy M. Sullivan |
2017-07-11 |
$1,748,000 |
| 9645573 |
Reliability monitor test strategy definition |
Stephen P. Ayotte, Petra U. Klinger-Park, Mark T.W. Lam, Sanda S. Myat |
2017-05-09 |
$2,584,000 |
| 9508680 |
Induction heating for underfill removal and chip rework |
Stephen P. Ayotte, Timothy M. Sullivan |
2016-11-29 |
$4,439,000 |
| 9472490 |
IC structure with recessed solder bump area and methods of forming same |
Timothy M. Sullivan, Stephen P. Ayotte, Timothy D. Sullivan |
2016-10-18 |
$3,531,000 |
| 9190375 |
Solder bump reflow by induction heating |
Stephen P. Ayotte, Sébastien S. Quesnel, Timothy D. Sullivan, Timothy M. Sullivan |
2015-11-17 |
$674,000 |
| 9177931 |
Reducing thermal energy transfer during chip-join processing |
Stephen P. Ayotte, Sébastien S. Quesnel, Timothy D. Sullivan, Timothy M. Sullivan |
2015-11-03 |
|
| 9105573 |
Visually detecting electrostatic discharge events |
Stephen P. Ayotte, David John Hill, John Thomas Kinnear, Jr., Timothy M. Sullivan, Heather M. Truax |
2015-08-11 |
$2,160,000 |
| 9059097 |
Inhibiting propagation of imperfections in semiconductor devices |
Stephen P. Ayotte, David John Hill, Timothy M. Sullivan, Heather M. Truax |
2015-06-16 |
$2,098,000 |
| 8765593 |
Controlled collapse chip connection (C4) structure and methods of forming |
Stephen P. Ayotte, Timothy H. Daubenspeck, David John Hill, Timothy M. Sullivan |
2014-07-01 |
$3,868,000 |
| 6901542 |
Internal cache for on chip test data storage |
Thomas Bartenstein, L. Farnsworth, Douglas C. Heaberlin, Edward E. Horton, III, Leendert M. Huisman +3 more |
2005-05-31 |
$8,494,000 |
| 6675323 |
Incremental fault dictionary |
Thomas Bartenstein, Douglas C. Heaberlin, Leendert M. Huisman, Thomas F. Mechler, Leah Pastel +1 more |
2004-01-06 |
$7,683,000 |
