Issued Patents All Time
Showing 25 most recent of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11662767 | Computing device display bonding | Kabir Siddiqui, Rajesh Manohar Dighde, Linghui Rao, Camilo Leon | 2023-05-30 |
| 11169576 | Folding accessory device support | Kent Allen Campbell, Paul Ryan SANDOVAL | 2021-11-09 |
| 11162633 | Magnetic mount for electronic devices | — | 2021-11-02 |
| 11075619 | Contactless readable programmable transponder to monitor chip join | Stephen P. Ayotte, Shawn P. Fetterolf, Adam J. McPadden | 2021-07-27 |
| 10996722 | Adaptive heat dissipation frame | Chau Van Ho, Avinash Raghuram | 2021-05-04 |
| 10838452 | Computing device display bonding | Kabir Siddiqui, Rajesh Manohar Dighde, Linghui Rao, Camilo Leon | 2020-11-17 |
| 10601404 | Contactless readable programmable transponder to monitor chip join | Stephen P. Ayotte, Shawn P. Fetterolf, Adam J. McPadden | 2020-03-24 |
| 10245667 | Chip joining by induction heating | Stephen P. Ayotte, Glen E. Richard, Timothy D. Sullivan | 2019-04-02 |
| 10248158 | Enclosure assembly and monitor device including same | James Wahl, Stephen A. Cummings, David Platt | 2019-04-02 |
| 10200016 | Contactless readable programmable transponder to monitor chip join | Stephen P. Ayotte, Shawn P. Fetterolf, Adam J. McPadden | 2019-02-05 |
| 10050012 | Method for semiconductor die removal rework | Stephen P. Ayotte, Glen E. Richard | 2018-08-14 |
| 9876487 | Contactless readable programmable transponder to monitor chip join | Stephen P. Ayotte, Shawn P. Fetterolf, Adam J. McPadden | 2018-01-23 |
| 9776270 | Chip joining by induction heating | Stephen P. Ayotte, Glen E. Richard, Timothy D. Sullivan | 2017-10-03 |
| 9711422 | Visually detecting electrostatic discharge events | Stephen P. Ayotte, David John Hill, John Thomas Kinnear, Jr., Glen E. Richard, Heather M. Truax | 2017-07-18 |
| 9704830 | Semiconductor structure and method of making | Stephen P. Ayotte, Glen E. Richard | 2017-07-11 |
| 9548275 | Detecting sudden changes in acceleration in semiconductor device or semiconductor packaging containing semiconductor device | Stephen P. Ayotte, Benjamin J. Pierce, Heather M. Truax | 2017-01-17 |
| 9508680 | Induction heating for underfill removal and chip rework | Stephen P. Ayotte, Glen E. Richard | 2016-11-29 |
| 9472490 | IC structure with recessed solder bump area and methods of forming same | Glen E. Richard, Stephen P. Ayotte, Timothy D. Sullivan | 2016-10-18 |
| 9216363 | Flying toy figurine | — | 2015-12-22 |
| 9190375 | Solder bump reflow by induction heating | Stephen P. Ayotte, Sébastien S. Quesnel, Glen E. Richard, Timothy D. Sullivan | 2015-11-17 |
| 9177931 | Reducing thermal energy transfer during chip-join processing | Stephen P. Ayotte, Sébastien S. Quesnel, Glen E. Richard, Timothy D. Sullivan | 2015-11-03 |
| 9105573 | Visually detecting electrostatic discharge events | Stephen P. Ayotte, David John Hill, John Thomas Kinnear, Jr., Glen E. Richard, Heather M. Truax | 2015-08-11 |
| 9059097 | Inhibiting propagation of imperfections in semiconductor devices | Stephen P. Ayotte, David John Hill, Glen E. Richard, Heather M. Truax | 2015-06-16 |
| 8862721 | Environmental footprint monitor for computer networks | Alexander David Wissner-Gross | 2014-10-14 |
| 8829674 | Stacked multi-chip package and method of making same | Stephen P. Ayotte, David John Hill | 2014-09-09 |