Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Reducing thermal energy transfer during chip-join processing

Reducing thermal energy transfer during chip-join processing

US Patent 9177931 · Granted Nov 3, 2015

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Computing device display bonding2023
Folding accessory device support2021
Magnetic mount for electronic devices2021
Contactless readable programmable transponder to monitor chip join2021
Contactless readable programmable transponder to monitor chip join2021
Adaptive heat dissipation frame2021
Computing device display bonding2020
Electromigration monitor2020
Electromigration monitor2020
Screening methodology to eliminate wire sweep in bond and assembly module packag2020
Contactless readable programmable transponder to monitor chip join2020
Contactless readable programmable transponder to monitor chip join2020