Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10605850 | Screening methodology to eliminate wire sweep in bond and assembly module packaging | Stephen P. Ayotte, Mark Tiam Weng Lam | 2020-03-31 |
| 9684034 | Efficient method of retesting integrated circuits | Teck Seng Eng, Louie Que Hermosura | 2017-06-20 |
| 9625524 | Efficient method of retesting integrated circuits | Teck Seng Eng, Louie Que Hermosura | 2017-04-18 |
| 9494650 | Efficient method of retesting integrated circuits | Teck Seng Eng, Louie Que Hermosura | 2016-11-15 |
| 9470740 | Screening methodology to eliminate wire sweep in bond and assembly module packaging | Stephen P. Ayotte, Mark Tiam Weng Lam | 2016-10-18 |