Issued Patents All Time
Showing 25 most recent of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12224203 | Air gap spacer formation for nano-scale semiconductor devices | Kangguo Cheng, Thomas J. Haigh, Jr., Juntao Li, Sanjay C. Mehta, Son V. Nguyen +2 more | 2025-02-11 |
| 11658062 | Air gap spacer formation for nano-scale semiconductor devices | Kangguo Cheng, Thomas J. Haigh, Jr., Juntao Li, Sanjay C. Mehta, Son V. Nguyen +2 more | 2023-05-23 |
| 10418277 | Air gap spacer formation for nano-scale semiconductor devices | Kangguo Cheng, Thomas J. Haigh, Jr., Juntao Li, Sanjay C. Mehta, Son V. Nguyen +2 more | 2019-09-17 |
| 10309884 | Predicting semiconductor package warpage | Stephen P. Ayotte, Travis S. Longenbach | 2019-06-04 |
| 10115629 | Air gap spacer formation for nano-scale semiconductor devices | Kangguo Cheng, Thomas J. Haigh, Jr., Juntao Li, Sanjay C. Mehta, Son V. Nguyen +2 more | 2018-10-30 |
| 9892961 | Air gap spacer formation for nano-scale semiconductor devices | Kangguo Cheng, Thomas J. Haigh, Jr., Juntao Li, Sanjay C. Mehta, Son V. Nguyen +2 more | 2018-02-13 |
| 9772268 | Predicting semiconductor package warpage | Stephen P. Ayotte, Travis S. Longenbach | 2017-09-26 |
| 9613900 | Nanoscale interconnect structure | Chih-Chao Yang, Stephan A. Cohen | 2017-04-04 |
| 9281211 | Nanoscale interconnect structure | Chih-Chao Yang, Stephan A. Cohen | 2016-03-08 |
| 9018089 | Multiple step anneal method and semiconductor formed by multiple step anneal | Griselda Bonilla, Pak Leung, Stephen A. Cohen, Stephen M. Gates, Thomas M. Shaw | 2015-04-28 |
| 7998880 | Low k dielectric CVD film formation process with in-situ imbedded nanolayers to improve mechanical properties | Son V. Nguyen, Sarah L. Lane, Kensaku Ida, Darryl D. Restaino | 2011-08-16 |
| 7678673 | Strengthening of a structure by infiltration | Elbert E. Huang, William Francis Landers, Michael Lane, Xiao Hu Liu, David L. Questad +1 more | 2010-03-16 |
| 7573130 | Crack trapping and arrest in thin film structures | Thomas M. Shaw, Michael Lane, Xio Hu Liu, Griselda Bonilla, James P. Doyle +1 more | 2009-08-11 |
| 7517790 | Method and structure to enhance temperature/humidity/bias performance of semiconductor devices by surface modification | John A. Fitzsimmons, Stephen M. Gates, Michael Lane | 2009-04-14 |
| 7491578 | Method of forming crack trapping and arrest in thin film structures | Thomas M. Shaw, Michael Lane, Xio Hu Liu, Griselda Bonilla, James P. Doyle +1 more | 2009-02-17 |
| 7357977 | Ultralow dielectric constant layer with controlled biaxial stress | Christos D. Dimitrakopoulos, Stephen M. Gates, Alfred Grill, Michael Lane, Xiao Hu Liu +3 more | 2008-04-15 |
| 7265437 | Low k dielectric CVD film formation process with in-situ imbedded nanolayers to improve mechanical properties | Son V. Nguyen, Sarah L. Lane, Kensaku Ida, Darryl D. Restaino | 2007-09-04 |
| 7247946 | On-chip Cu interconnection using 1 to 5 nm thick metal cap | John Bruley, Roy A. Carruthers, Lynne M. Gignac, Chao-Kun Hu, Sandra G. Malhotra +1 more | 2007-07-24 |
| 7163883 | Edge seal for a semiconductor device | Birendra Agarwala, Hormazdyar M. Dalal, Diana Llera-Hurlburt, Du Nguyen, Richard W. Procter +3 more | 2007-01-16 |
| 6915795 | Method and system for dicing wafers, and semiconductor structures incorporating the products thereof | Donald W. Brouillette, Robert F. Cook, Thomas G. Ference, Wayne J. Howell, Ronald L. Mendelson | 2005-07-12 |
| 6734090 | Method of making an edge seal for a semiconductor device | Birendra Agarwala, Hormazdyar M. Dalal, Diana Llera-Hurlburt, Du Nguyen, Richard W. Procter +3 more | 2004-05-11 |
| 6636290 | Methods of forming liquid display panels and the like wherein using two-component epoxy sealant | James H. Glownia, Gareth G. Hougham, Robert J. von Gutfeld | 2003-10-21 |
| 6600213 | Semiconductor structure and package including a chip having chamfered edges | Donald W. Brouillette, Robert F. Cook, Thomas G. Ference, Wayne J. Howell, Ronald L. Mendelson | 2003-07-29 |
| 6455443 | Method of fabricating low-dielectric constant interlevel dielectric films for BEOL interconnects with enhanced adhesion and low-defect density | Andrew Robert Eckert, John C. Hay, Jr., Jeffrey Hedrick, Kang-Wook Lee, Eva E. Simonyi | 2002-09-24 |
| 6271102 | Method and system for dicing wafers, and semiconductor structures incorporating the products thereof | Donald W. Brouillette, Robert F. Cook, Thomas G. Ference, Wayne J. Howell, Ronald L. Mendelson | 2001-08-07 |