| 12224203 |
Air gap spacer formation for nano-scale semiconductor devices |
Kangguo Cheng, Thomas J. Haigh, Jr., Juntao Li, Sanjay C. Mehta, Son V. Nguyen +2 more |
2025-02-11 |
|
| 11658062 |
Air gap spacer formation for nano-scale semiconductor devices |
Kangguo Cheng, Thomas J. Haigh, Jr., Juntao Li, Sanjay C. Mehta, Son V. Nguyen +2 more |
2023-05-23 |
$10,420,000 |
| 10418277 |
Air gap spacer formation for nano-scale semiconductor devices |
Kangguo Cheng, Thomas J. Haigh, Jr., Juntao Li, Sanjay C. Mehta, Son V. Nguyen +2 more |
2019-09-17 |
$3,647,000 |
| 10309884 |
Predicting semiconductor package warpage |
Stephen P. Ayotte, Travis S. Longenbach |
2019-06-04 |
$2,774,000 |
| 10115629 |
Air gap spacer formation for nano-scale semiconductor devices |
Kangguo Cheng, Thomas J. Haigh, Jr., Juntao Li, Sanjay C. Mehta, Son V. Nguyen +2 more |
2018-10-30 |
$2,799,000 |
| 9892961 |
Air gap spacer formation for nano-scale semiconductor devices |
Kangguo Cheng, Thomas J. Haigh, Jr., Juntao Li, Sanjay C. Mehta, Son V. Nguyen +2 more |
2018-02-13 |
$2,196,000 |
| 9772268 |
Predicting semiconductor package warpage |
Stephen P. Ayotte, Travis S. Longenbach |
2017-09-26 |
$3,108,000 |
| 9613900 |
Nanoscale interconnect structure |
Chih-Chao Yang, Stephan A. Cohen |
2017-04-04 |
$2,713,000 |
| 9281211 |
Nanoscale interconnect structure |
Chih-Chao Yang, Stephan A. Cohen |
2016-03-08 |
$4,405,000 |
| 9018089 |
Multiple step anneal method and semiconductor formed by multiple step anneal |
Griselda Bonilla, Pak Leung, Stephen A. Cohen, Stephen M. Gates, Thomas M. Shaw |
2015-04-28 |
$3,749,000 |
| 7998880 |
Low k dielectric CVD film formation process with in-situ imbedded nanolayers to improve mechanical properties |
Son V. Nguyen, Sarah L. Lane, Kensaku Ida, Darryl D. Restaino |
2011-08-16 |
|
| 7678673 |
Strengthening of a structure by infiltration |
Elbert E. Huang, William Francis Landers, Michael Lane, Xiao Hu Liu, David L. Questad +1 more |
2010-03-16 |
$7,988,000 |
| 7573130 |
Crack trapping and arrest in thin film structures |
Thomas M. Shaw, Michael Lane, Xio Hu Liu, Griselda Bonilla, James P. Doyle +1 more |
2009-08-11 |
$14,264,000 |
| 7517790 |
Method and structure to enhance temperature/humidity/bias performance of semiconductor devices by surface modification |
John A. Fitzsimmons, Stephen M. Gates, Michael Lane |
2009-04-14 |
$4,368,000 |
| 7491578 |
Method of forming crack trapping and arrest in thin film structures |
Thomas M. Shaw, Michael Lane, Xio Hu Liu, Griselda Bonilla, James P. Doyle +1 more |
2009-02-17 |
$3,763,000 |
| 7357977 |
Ultralow dielectric constant layer with controlled biaxial stress |
Christos D. Dimitrakopoulos, Stephen M. Gates, Alfred Grill, Michael Lane, Xiao Hu Liu +3 more |
2008-04-15 |
$8,007,000 |
| 7265437 |
Low k dielectric CVD film formation process with in-situ imbedded nanolayers to improve mechanical properties |
Son V. Nguyen, Sarah L. Lane, Kensaku Ida, Darryl D. Restaino |
2007-09-04 |
|
| 7247946 |
On-chip Cu interconnection using 1 to 5 nm thick metal cap |
John Bruley, Roy A. Carruthers, Lynne M. Gignac, Chao-Kun Hu, Sandra G. Malhotra +1 more |
2007-07-24 |
$9,916,000 |
| 7163883 |
Edge seal for a semiconductor device |
Birendra Agarwala, Hormazdyar M. Dalal, Diana Llera-Hurlburt, Du Nguyen, Richard W. Procter +3 more |
2007-01-16 |
$24,143,000 |
| 6915795 |
Method and system for dicing wafers, and semiconductor structures incorporating the products thereof |
Donald W. Brouillette, Robert F. Cook, Thomas G. Ference, Wayne J. Howell, Ronald L. Mendelson |
2005-07-12 |
$9,006,000 |
| 6734090 |
Method of making an edge seal for a semiconductor device |
Birendra Agarwala, Hormazdyar M. Dalal, Diana Llera-Hurlburt, Du Nguyen, Richard W. Procter +3 more |
2004-05-11 |
$7,887,000 |
| 6636290 |
Methods of forming liquid display panels and the like wherein using two-component epoxy sealant |
James H. Glownia, Gareth G. Hougham, Robert J. von Gutfeld |
2003-10-21 |
$7,269,000 |
| 6600213 |
Semiconductor structure and package including a chip having chamfered edges |
Donald W. Brouillette, Robert F. Cook, Thomas G. Ference, Wayne J. Howell, Ronald L. Mendelson |
2003-07-29 |
$10,466,000 |
| 6455443 |
Method of fabricating low-dielectric constant interlevel dielectric films for BEOL interconnects with enhanced adhesion and low-defect density |
Andrew Robert Eckert, John C. Hay, Jr., Jeffrey Hedrick, Kang-Wook Lee, Eva E. Simonyi |
2002-09-24 |
$8,983,000 |
| 6271102 |
Method and system for dicing wafers, and semiconductor structures incorporating the products thereof |
Donald W. Brouillette, Robert F. Cook, Thomas G. Ference, Wayne J. Howell, Ronald L. Mendelson |
2001-08-07 |
$22,988,000 |
