| 10199516 |
Method for fabricating a photovoltaic device by uniform plating on dielectric passivated through-wafer vias and interconnects |
Brett C. Baker-O'Neal, Shu-Yun Chong, John M. Cotte, Ronald D. Goldblatt, Qiang Huang +4 more |
2019-02-05 |
$9,200,000 |
| 9716192 |
Method for fabricating a photovoltaic device by uniform plating on emitter-lined through-wafer vias and interconnects |
Brett C. Baker-O'Neal, Shu-Yun Chong, John M. Cotte, Ronald D. Goldblatt, Qiang Huang +4 more |
2017-07-25 |
$2,827,000 |
| RE45781 |
Toughness, adhesion and smooth metal lines of porous low K dielectric interconnect structures |
Kang-Wook Lee, Kelly Malone, Christy S. Tyberg |
2015-10-27 |
|
| 8865502 |
Solar cells with plated back side surface field and back side electrical contact and method of fabricating same |
Kathryn C. Fisher, Nicholas C. M. Fuller, Satyavolu S. Papa Rao, Xiaoyan Shao |
2014-10-21 |
$3,429,000 |
| 8491987 |
Selectively coated self-aligned mask |
Matthew E. Colburn, Stephen M. Gates, Elbert E. Huang, Satyanarayana V. Nitta, Sampath Purushothaman +1 more |
2013-07-23 |
$2,085,000 |
| 8445316 |
Non-lithographic method of patterning contacts for a photovoltaic device |
Ali Afzali-Ardakani, Mahmoud Khojasteh, Young-Hee Kim |
2013-05-21 |
$6,083,000 |
| 7951705 |
Multilayered cap barrier in microelectronic interconnect structures |
Elbert E. Huang |
2011-05-31 |
$4,283,000 |
| 7948051 |
Nonlithographic method to produce self-aligned mask, articles produced by same and compositions for same |
Matthew E. Colburn, Stephen M. Gates, Elbert E. Huang, Satyanarayana V. Nitta, Sampath Purushothaman +1 more |
2011-05-24 |
$5,693,000 |
| 7695776 |
Transparent hard coats for optical elements |
David Lewis, Stanley Joseph Whitehair |
2010-04-13 |
$5,309,000 |
| 7485341 |
Nonlithographic method to produce masks by selective reaction, articles produced, and composition for same |
Matthew E. Colburn, Stephen M. Gates, Elbert E. Huang, Satyanarayana V. Nitta, Sampath Purushothaman +1 more |
2009-02-03 |
$3,057,000 |
| 7470597 |
Method of fabricating a multilayered dielectric diffusion barrier layer |
Elbert E. Huang |
2008-12-30 |
$5,097,000 |
| 7378146 |
Transparent hard coats for optical elements |
David Lewis, Stanley Joseph Whitehair |
2008-05-27 |
$8,304,000 |
| 7256146 |
Method of forming a ceramic diffusion barrier layer |
Stephan A. Cohen, Stephen M. Gates, Elbert E. Huang, Dirk Pfeiffer |
2007-08-14 |
$10,148,000 |
| 7098476 |
Multilayer interconnect structure containing air gaps and method for making |
Katherina Babich, Roy A. Carruthers, Timothy J. Dalton, Alfred Grill, Christopher V. Jahnes +4 more |
2006-08-29 |
$3,832,000 |
| 7084479 |
Line level air gaps |
Shyng-Tsong Chen, Stefanie Chiras, Matthew E. Colburn, Timothy J. Dalton, Elbert E. Huang +9 more |
2006-08-01 |
$2,070,000 |
| 7081673 |
Multilayered cap barrier in microelectronic interconnect structures |
Elbert E. Huang |
2006-07-25 |
$9,389,000 |
| 6940173 |
Interconnect structures incorporating low-k dielectric barrier films |
Stephan A. Cohen, Stephen M. Gates, Elbert E. Huang, Dirk Pfeiffer |
2005-09-06 |
$5,379,000 |
| 6933586 |
Porous low-k dielectric interconnects with improved adhesion produced by partial burnout of surface porogens |
Ann R. Fornof, Kang-Wook Lee, Christy S. Tyberg |
2005-08-23 |
$5,305,000 |
| 6929982 |
Patterning layers comprised of spin-on ceramic films |
Stephen M. Gates, Elbert E. Huang, Dirk Pfeiffer |
2005-08-16 |
$6,237,000 |
| 6911400 |
Nonlithographic method to produce self-aligned mask, articles produced by same and compositions for same |
Matthew E. Colburn, Stephen M. Gates, Elbert E. Huang, Satyanarayana V. Nitta, Sampath Purushothaman +1 more |
2005-06-28 |
$7,000,000 |
| 6864180 |
Method for reworking low-k polymers used in semiconductor structures |
Darryl D. Restaino, Delores Bennett, John A. Fitzsimmons, John Fritche, Chih-Chien Liu +2 more |
2005-03-08 |
$6,470,000 |
| 6844257 |
Porous low-k dielectric interconnects with improved adhesion produced by partial burnout of surface porogens |
Ann R. Fornof, Kang-Wook Lee, Christy S. Tyberg |
2005-01-18 |
$12,326,000 |
| 6831364 |
Method for forming a porous dielectric material layer in a semiconductor device and device formed |
Timothy J. Dalton, Stephen E. Greco, Satyanarayana V. Nitta, Sampath Purushothaman, Kenneth P. Rodbell +1 more |
2004-12-14 |
$7,399,000 |
| 6831366 |
Interconnects containing first and second porous low-k dielectrics separated by a porous buried etch stop layer |
Stephen M. Gates, Satyanarayana V. Nitta, Sampath Purushothaman, Cristy Sensenich Tyberg |
2004-12-14 |
$7,399,000 |
| 6818285 |
Composition and method to achieve reduced thermal expansion in polyarylene networks |
Muthumanickam Sankarapandian, Christy S. Tyberg, James P. Godschalx, Qingshan Jason Niu, Harry Craig Silvis |
2004-11-16 |
$5,414,000 |
