Issued Patents All Time
Showing 26–50 of 70 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6815329 | Multilayer interconnect structure containing air gaps and method for making | Katherina Babich, Roy A. Carruthers, Timothy J. Dalton, Alfred Grill, Christopher V. Jahnes +4 more | 2004-11-09 |
| 6803660 | Patterning layers comprised of spin-on ceramic films | Stephen M. Gates, Elbert E. Huang, Dirk Pfeiffer | 2004-10-12 |
| 6783862 | Toughness, adhesion and smooth metal lines of porous low k dielectric interconnect structures | Kang-Wook Lee, Kelly Malone, Christy S. Tyberg | 2004-08-31 |
| 6737725 | Multilevel interconnect structure containing air gaps and method for making | Alfred Grill, Christopher V. Jahnes, Satyanarayana V. Nitta, Kevin S. Petrarca, Sampath Purushothaman +2 more | 2004-05-18 |
| 6730618 | Low k dielectric materials with inherent copper ion migration barrier | Stephan A. Cohen, Claudius Feger, Jane M. Shaw | 2004-05-04 |
| 6724069 | Spin-on cap layer, and semiconductor device containing same | Timothy J. Dalton, Stephen M. Gates, Satyanarayana V. Nitta, Sampath Purushothaman, Christy S. Tyberg | 2004-04-20 |
| 6716742 | Low-k interconnect structure comprised of a multilayer of spin-on porous dielectrics | Stephen M. Gates, Satyanarayana V. Nitta, Sampath Purushothaman, Cristy Sensenich Tyberg | 2004-04-06 |
| 6710450 | Interconnect structure with precise conductor resistance and method to form same | Stephen M. Gates, Satyanarayana V. Nitta, Sampath Purushothaman, Cristy Sensenich Tyberg | 2004-03-23 |
| 6677680 | Hybrid low-k interconnect structure comprised of 2 spin-on dielectric materials | Stephen M. Gates, Satyanarayana V. Nitta, Sampath Purushothaman, Cristy Sensenich Tyberg | 2004-01-13 |
| 6641899 | Nonlithographic method to produce masks by selective reaction, articles produced, and composition for same | Matthew E. Colburn, Stephen M. Gates, Elbert E. Huang, Satyanarayana V. Nitta, Sampath Purushothaman +1 more | 2003-11-04 |
| 6638878 | Film planarization for low-k polymers used in semiconductor structures | Darryl D. Restaino, John A. Fitzsimmons, Christy S. Tyberg, Chih-Chien Liu, Shahab Siddiqui | 2003-10-28 |
| 6603204 | Low-k interconnect structure comprised of a multilayer of spin-on porous dielectrics | Stephen M. Gates, Satyanarayana V. Nitta, Sampath Purushothaman, Cristy Sensenich Tyberg | 2003-08-05 |
| 6537908 | Method for dual-damascence patterning of low-k interconnects using spin-on distributed hardmask | Ann R. Fornof, Stephen M. Gates, Satyanarayana V. Nitta, Sampath Purushothaman, Christy S. Tyberg | 2003-03-25 |
| 6486557 | Hybrid dielectric structure for improving the stiffness of back end of the line structures | Charles R. Davis, Daniel C. Edelstein, John C. Hay, Jr., Christopher V. Jahnes, Vincent J. McGahay +1 more | 2002-11-26 |
| 6455443 | Method of fabricating low-dielectric constant interlevel dielectric films for BEOL interconnects with enhanced adhesion and low-defect density | Andrew Robert Eckert, John C. Hay, Jr., Kang-Wook Lee, Eric G. Liniger, Eva E. Simonyi | 2002-09-24 |
| 6451712 | Method for forming a porous dielectric material layer in a semiconductor device and device formed | Timothy J. Dalton, Stephen E. Greco, Satyanarayana V. Nitta, Sampath Purushothaman, Kenneth P. Rodbell +1 more | 2002-09-17 |
| 6413852 | Method of forming multilevel interconnect structure containing air gaps including utilizing both sacrificial and placeholder material | Alfred Grill, Christopher V. Jahnes, Satyanarayana V. Nitta, Kevin S. Petrarca, Sampath Purushothaman +2 more | 2002-07-02 |
| 6414377 | Low k dielectric materials with inherent copper ion migration barrier | Stephan A. Cohen, Claudius Feger, Jane M. Shaw | 2002-07-02 |
| 6323436 | High density printed wiring board possessing controlled coefficient of thermal expansion with thin film redistribution layer | Kostas Papathomas, Amarjit S. Rai, Stephen L. Tisdale, Alfred Viehbeck | 2001-11-27 |
| 6242139 | Color filter for TFT displays | David Lewis, Stanley Joseph Whitehair | 2001-06-05 |
| 6225373 | Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin | Jeffrey T. Gotro, Konstantinos I. Papathomas, Niranjan M. Patel, Alfred Viehbeck, William D. Joseph | 2001-05-01 |
| 6093636 | Process for manufacture of integrated circuit device using a matrix comprising porous high temperature thermosets | Kenneth Raymond Carter, Daniel J. Dawson, Craig J. Hawker, James L. Hedrick, Victor Y. Lee +3 more | 2000-07-25 |
| 5919596 | Toughened photosensitive polycyanurate resist, and structure made therefrom and process of making | Konstantinos I. Papathomas, Stephen L. Tisdale, Alfred Viehbeck, Jeffrey D. Gelorme, Voya R. Markovich +2 more | 1999-07-06 |
| 5898991 | Methods of fabrication of coaxial vias and magnetic devices | Keith E. Fogel, David Lewis, Eva E. Simonyi, Alfred Viehbeck, Stanley Joseph Whitehair | 1999-05-04 |
| 5863332 | Fluid jet impregnating and coating device with thickness control capability | Elizabeth Foster, Robert M. Japp, Kostas Papathomas, Stephen L. Tisdale, Alfred Viehbeck | 1999-01-26 |