Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10199516 | Method for fabricating a photovoltaic device by uniform plating on dielectric passivated through-wafer vias and interconnects | Brett C. Baker-O'Neal, Shu-Yun Chong, John M. Cotte, Jeffrey Hedrick, Qiang Huang +4 more | 2019-02-05 |
| 9716192 | Method for fabricating a photovoltaic device by uniform plating on emitter-lined through-wafer vias and interconnects | Brett C. Baker-O'Neal, Shu-Yun Chong, John M. Cotte, Jeffrey Hedrick, Qiang Huang +4 more | 2017-07-25 |
| 9666749 | Low resistance, low reflection, and low cost contact grids for photovoltaic cells | Harold J. Hovel, Xiaoyan Shao, Steven E. Steen | 2017-05-30 |
| 9337363 | Low resistance, low reflection, and low cost contact grids for photovoltaic cells | Harold J. Hovel, Xiaoyan Shao, Steven E. Steen | 2016-05-10 |
| 9300284 | Device select system for multi-device electronic system | Robert G. Biskeborn | 2016-03-29 |
| 7294565 | Method of fabricating a wire bond pad with Ni/Au metallization | Lloyd Burrell, Charles R. Davis, William Francis Landers, Sanjay C. Mehta | 2007-11-13 |
| 7098676 | Multi-functional structure for enhanced chip manufacturibility and reliability for low k dielectrics semiconductors and a crackstop integrity screen and monitor | William Francis Landers, Thomas M. Shaw, Diana Llera-Hurlburt, Scott W. Crowder, Vincent J. McGahay +3 more | 2006-08-29 |
| 6534863 | Common ball-limiting metallurgy for I/O sites | George F. Walker, Peter A. Gruber, Raymond R. Horton, Kevin S. Petrarca, Richard P. Volant +1 more | 2003-03-18 |
| 6395164 | Copper seed layer repair technique using electroless touch-up | Panayotis Andricacos, James E. Fluegel, John G. Gaudiello, Sandra G. Malhotra, Milan Paunovic | 2002-05-28 |
| 6339022 | Method of annealing copper metallurgy | Arne Ballantine, Edward C. Cooney, III, George A. Dunbar, III, Cheryl G. Faltermeier, Jeffrey D. Gilbert +9 more | 2002-01-15 |
| 6333559 | Method/structure for creating aluminum wirebound pad on copper BEOL | Gregory Costrini, John E. Heidenreich, III, Thomas L. McDevitt | 2001-12-25 |
| 6187680 | Method/structure for creating aluminum wirebound pad on copper BEOL | Gregory Costrini, John E. Heidenreich, III, Thomas L. McDevitt | 2001-02-13 |
| 5357005 | Reactive surface functionalization | Stephen L. Buchwalter, Charles R. Davis, Richard R. Thomas | 1994-10-18 |
| 5340451 | Process for producing a metal organic polymer combination | Leena Paivikki Buchwalter, Stephen L. Buchwalter, Charles R. Davis, John E. Heidenreich, III, Sharon L. Nunes +4 more | 1994-08-23 |
| 5208068 | Lamination method for coating the sidewall or filling a cavity in a substrate | Charles R. Davis | 1993-05-04 |
| 5178914 | Means of seeding and metallizing polymide | Caroline A. Kovac, Domenico Tortorella | 1993-01-12 |
| 5019210 | Method for enhancing the adhesion of polymer surfaces by water vapor plasma treatment | Ned J. Chou, John E. Heidenreich, III, Steven E. Molis, Luis M. Ferreiro, deceased | 1991-05-28 |