| 5786986 |
Multi-level circuit card structure |
Mark F. Bregman, Stephen L. Buchwalter, Karl Hermann, Paige A. Poore, Alfred Viehbeck |
1998-07-28 |
| 5503698 |
Bonding method employing organometallic interconnectors |
Martin J. Goldberg, Hiroshi Ito, Michael J. Palmer, Roger A. Pollak, Paige A. Poore |
1996-04-02 |
| 5462628 |
Method for bonding two surfaces together |
Alfred Viehbeck, Martin J. Goldberg, Stephen L. Tisdale, Stephen L. Buchwalter, Kurt R. Grebe +1 more |
1995-10-31 |
| 5242713 |
Method for conditioning an organic polymeric material |
Alfred Viehbeck, Stephen L. Buchwalter, William A. Donson, John J. Glenning, Martin J. Goldberg +6 more |
1993-09-07 |
| 5203955 |
Method for etching an organic polymeric material |
Aldred Viehbeck, Stephen L. Buchwalter, John J. Glenning, Martin J. Goldberg, Linda C. Matthew +2 more |
1993-04-20 |
| 5178914 |
Means of seeding and metallizing polymide |
Ronald D. Goldblatt, Domenico Tortorella |
1993-01-12 |
| 5135779 |
Method for conditioning an organic polymeric material |
Alfred Viehbeck, Stephen L. Buchwalter, Martin J. Goldberg, Stephen L. Tisdale |
1992-08-04 |
| 5132351 |
Chemical solder comprising a metal salt, polyphthalaldehyde and a solvent |
Martin J. Goldberg, Hiroshi Ito, Michael J. Palmer, Roger A. Pollak, Paige A. Poore |
1992-07-21 |
| 5130781 |
Dam for lead encapsulation |
Peter G. Ledermann, Luu Thanh Nguyen |
1992-07-14 |
| 5047834 |
High strength low stress encapsulation of interconnected semiconductor devices |
Ismail C. Noyan |
1991-09-10 |
| 4881885 |
Dam for lead encapsulation |
Peter G. Ledermann, Luu Thanh Nguyen |
1989-11-21 |
| 4869930 |
Method for preparing substrates for deposition of metal seed from an organometallic vapor for subsequent electroless metallization |
Thomas Carl Clarke, Dae Young Jung, Jae Man Park, Richard R. Thomas |
1989-09-26 |
| 4862322 |
Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween |
Harry R. Bickford, Mark F. Bregman, Paul A. Moskowitz, Michael J. Palmer, Timothy C. Reiley +1 more |
1989-08-29 |
| 4832255 |
Precision solder transfer method and means |
Harry R. Bickford, Kurt R. Grebe, Michael J. Palmer |
1989-05-23 |
| 4780754 |
Polysiloxane modified cement |
John J. Liutkus |
1988-10-25 |
| 4574095 |
Selective deposition of copper |
Thomas H. Baum, Frances Anne Houle, Carol R. Jones |
1986-03-04 |
