KH

Karl Hermann

IBM: 18 patents #6,125 of 70,183Top 9%
DI Diebold: 2 patents #224 of 365Top 65%
Overall (All Time): #226,525 of 4,157,543Top 6%
20
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
5786986 Multi-level circuit card structure Mark F. Bregman, Stephen L. Buchwalter, Caroline A. Kovac, Paige A. Poore, Alfred Viehbeck 1998-07-28
5697234 Multiple lock assembly Benjamin F. Lozier, Custodio M. Fabella, Jr. 1997-12-16
5603234 Multiple lock assembly Benjamin F. Lozier, Custodio M. Fabella, Jr. 1997-02-18
5363275 Modular component computer system Jerome A. Frankeny, Richard F. Frankeny, Ronald L. Imken 1994-11-08
5313097 High density memory module Javad Haj-Ali-Ahmadi, Paul A. Farrar, Jerome A. Frankeny, Richard F. Frankeny, Jacqueline A. Shorter-Beauchamp +1 more 1994-05-17
5290710 Method for testing integrated circuits on a carrier substrate Javad Haj-Ali-Ahmadi, Jerome A. Frankeny, Richard F. Frankeny, Adolph B. Habich, Ronald E. Hunt 1994-03-01
5222668 Fluid actuated connector Richard F. Frankeny, Ronald E. Hunt, Verlon E. Whitehead 1993-06-29
5205740 Super connector for connecting flat ribbon cables Richard F. Frankeny, Ronald E. Hunt, Verlon E. Whitehead 1993-04-27
5161087 Pivotal heat sink assembly Jerome A. Frankeny, Richard F. Frankeny, Rolf Wustrau 1992-11-03
5146674 Manufacturing process of a high density substrate design Richard F. Frankeny, Ronald L. Imken, Joseph LaTorre 1992-09-15
5148003 Modular test oven Javad Haj-Ali-Ahmadi, Jerome A. Frankeny, Richard F. Frankeny, Adolph B. Habich, Ronald E. Hunt 1992-09-15
5140879 Variable array punch Javad Haj-Ali-Ahmadi, Jerome A. Frankeny 1992-08-25
5121299 Multi-level circuit structure utilizing conductive cores having conductive protrusions and cavities therein Richard F. Frankeny 1992-06-09
5065227 Integrated circuit packaging using flexible substrate Jerome A. Frankeny, Richard F. Frankeny, Ronald L. Imken 1991-11-12
5053853 Modular electronic packaging system Javad Haj-Ali-Ahmadi, Richard F. Frankeny 1991-10-01
5037311 High density interconnect strip Jerome A. Frankeny, Richard F. Frankeny, Javad Haj-Ali-Ahmadi, Ronald L. Imken 1991-08-06
5006924 Heat sink for utilization with high density integrated circuit substrates Richard F. Frankeny 1991-04-09
4975637 Method and apparatus for integrated circuit device testing Richard F. Frankeny 1990-12-04
4946708 Pin transfer adhesive application for surface mount component processes Adolph B. Habich, Ronald E. Hunt, Verlon E. Whitehead 1990-08-07
4495479 Selective wiring for multilayer printed circuit board 1985-01-22