| 5786986 |
Multi-level circuit card structure |
Mark F. Bregman, Stephen L. Buchwalter, Caroline A. Kovac, Paige A. Poore, Alfred Viehbeck |
1998-07-28 |
| 5697234 |
Multiple lock assembly |
Benjamin F. Lozier, Custodio M. Fabella, Jr. |
1997-12-16 |
| 5603234 |
Multiple lock assembly |
Benjamin F. Lozier, Custodio M. Fabella, Jr. |
1997-02-18 |
| 5363275 |
Modular component computer system |
Jerome A. Frankeny, Richard F. Frankeny, Ronald L. Imken |
1994-11-08 |
| 5313097 |
High density memory module |
Javad Haj-Ali-Ahmadi, Paul A. Farrar, Jerome A. Frankeny, Richard F. Frankeny, Jacqueline A. Shorter-Beauchamp +1 more |
1994-05-17 |
| 5290710 |
Method for testing integrated circuits on a carrier substrate |
Javad Haj-Ali-Ahmadi, Jerome A. Frankeny, Richard F. Frankeny, Adolph B. Habich, Ronald E. Hunt |
1994-03-01 |
| 5222668 |
Fluid actuated connector |
Richard F. Frankeny, Ronald E. Hunt, Verlon E. Whitehead |
1993-06-29 |
| 5205740 |
Super connector for connecting flat ribbon cables |
Richard F. Frankeny, Ronald E. Hunt, Verlon E. Whitehead |
1993-04-27 |
| 5161087 |
Pivotal heat sink assembly |
Jerome A. Frankeny, Richard F. Frankeny, Rolf Wustrau |
1992-11-03 |
| 5146674 |
Manufacturing process of a high density substrate design |
Richard F. Frankeny, Ronald L. Imken, Joseph LaTorre |
1992-09-15 |
| 5148003 |
Modular test oven |
Javad Haj-Ali-Ahmadi, Jerome A. Frankeny, Richard F. Frankeny, Adolph B. Habich, Ronald E. Hunt |
1992-09-15 |
| 5140879 |
Variable array punch |
Javad Haj-Ali-Ahmadi, Jerome A. Frankeny |
1992-08-25 |
| 5121299 |
Multi-level circuit structure utilizing conductive cores having conductive protrusions and cavities therein |
Richard F. Frankeny |
1992-06-09 |
| 5065227 |
Integrated circuit packaging using flexible substrate |
Jerome A. Frankeny, Richard F. Frankeny, Ronald L. Imken |
1991-11-12 |
| 5053853 |
Modular electronic packaging system |
Javad Haj-Ali-Ahmadi, Richard F. Frankeny |
1991-10-01 |
| 5037311 |
High density interconnect strip |
Jerome A. Frankeny, Richard F. Frankeny, Javad Haj-Ali-Ahmadi, Ronald L. Imken |
1991-08-06 |
| 5006924 |
Heat sink for utilization with high density integrated circuit substrates |
Richard F. Frankeny |
1991-04-09 |
| 4975637 |
Method and apparatus for integrated circuit device testing |
Richard F. Frankeny |
1990-12-04 |
| 4946708 |
Pin transfer adhesive application for surface mount component processes |
Adolph B. Habich, Ronald E. Hunt, Verlon E. Whitehead |
1990-08-07 |
| 4495479 |
Selective wiring for multilayer printed circuit board |
— |
1985-01-22 |