Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5786986 | Multi-level circuit card structure | Mark F. Bregman, Stephen L. Buchwalter, Karl Hermann, Caroline A. Kovac, Alfred Viehbeck | 1998-07-28 |
| 5503698 | Bonding method employing organometallic interconnectors | Martin J. Goldberg, Hiroshi Ito, Caroline A. Kovac, Michael J. Palmer, Roger A. Pollak | 1996-04-02 |
| 5132351 | Chemical solder comprising a metal salt, polyphthalaldehyde and a solvent | Martin J. Goldberg, Hiroshi Ito, Caroline A. Kovac, Michael J. Palmer, Roger A. Pollak | 1992-07-21 |
| 4862322 | Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween | Harry R. Bickford, Mark F. Bregman, Paul A. Moskowitz, Michael J. Palmer, Timothy C. Reiley +1 more | 1989-08-29 |