Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9148353 | Systems and methods for correlating computing problems referenced in social-network communications with events potentially responsible for the same | Joseph Pasqua | 2015-09-29 |
| 8332947 | Security threat reporting in light of local security tools | William E. Sobel | 2012-12-11 |
| 6332127 | Systems, methods and computer program products for providing time and location specific advertising via the internet | Daniel Quinto Bandera, Ajei Sarat Gopal, Sandeep K. Singhal | 2001-12-18 |
| 5786986 | Multi-level circuit card structure | Stephen L. Buchwalter, Karl Hermann, Caroline A. Kovac, Paige A. Poore, Alfred Viehbeck | 1998-07-28 |
| 5322204 | Electronic substrate multiple location conductor attachment technology | Raymond R. Horton, Alphonso P. Lanzetta, Ismail C. Noyan, Michael J. Palmer, Ho-Ming Tong | 1994-06-21 |
| 5233221 | Electronic substrate multiple location conductor attachment technology | Raymond R. Horton, Alphonso P. Lanzetta, Ismail C. Noyan, Michael J. Palmer, Ho-Ming Tong | 1993-08-03 |
| 5229328 | Method for bonding dielectric mounted conductors to semiconductor chip contact pads | Raymond R. Horton, Alphonso P. Lanzetta, Ismail C. Noyan, Michael J. Palmer, Ho-Ming Tong | 1993-07-20 |
| 5189363 | Integrated circuit testing system having a cantilevered contact lead probe pattern mounted on a flexible tape for interconnecting an integrated circuit to a tester | Paul R. Hoffman, Peter G. Ledermann, Paul A. Moskowitz, Roger A. Pollak, Timothy C. Reiley +1 more | 1993-02-23 |
| 5117275 | Electronic substrate multiple location conductor attachment technology | Raymond R. Horton, Alphonso P. Lanzetta, Ismail C. Noyan, Michael J. Palmer, Ho-Ming Tong | 1992-05-26 |
| 5093890 | Optical bus for computer systems | Ismail C. Noyan, Mark B. Ritter, Harold S. Stone | 1992-03-03 |
| 5093879 | Electro-optical connectors | William D. Brewer, Mitchell S. Cohen, Glen Walden Johnson, Ismail C. Noyan, Modest M. Oprysko +3 more | 1992-03-03 |
| 5028983 | Multilevel integrated circuit packaging structures | Harry R. Bickford, Thomas M. Cipolla, John Gow, 3rd, Peter G. Ledermann, Ekkehard F. Miersch +5 more | 1991-07-02 |
| 5006925 | Three dimensional microelectric packaging | Raymond R. Horton, Ismail C. Noyan, Michael J. Palmer | 1991-04-09 |
| 4862322 | Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween | Harry R. Bickford, Paul A. Moskowitz, Michael J. Palmer, Timothy C. Reiley, Paige A. Poore +1 more | 1989-08-29 |