| 9148353 |
Systems and methods for correlating computing problems referenced in social-network communications with events potentially responsible for the same |
Joseph Pasqua |
2015-09-29 |
| 8332947 |
Security threat reporting in light of local security tools |
William E. Sobel |
2012-12-11 |
| 6332127 |
Systems, methods and computer program products for providing time and location specific advertising via the internet |
Daniel Quinto Bandera, Ajei Sarat Gopal, Sandeep K. Singhal |
2001-12-18 |
| 5786986 |
Multi-level circuit card structure |
Stephen L. Buchwalter, Karl Hermann, Caroline A. Kovac, Paige A. Poore, Alfred Viehbeck |
1998-07-28 |
| 5322204 |
Electronic substrate multiple location conductor attachment technology |
Raymond R. Horton, Alphonso P. Lanzetta, Ismail C. Noyan, Michael J. Palmer, Ho-Ming Tong |
1994-06-21 |
| 5233221 |
Electronic substrate multiple location conductor attachment technology |
Raymond R. Horton, Alphonso P. Lanzetta, Ismail C. Noyan, Michael J. Palmer, Ho-Ming Tong |
1993-08-03 |
| 5229328 |
Method for bonding dielectric mounted conductors to semiconductor chip contact pads |
Raymond R. Horton, Alphonso P. Lanzetta, Ismail C. Noyan, Michael J. Palmer, Ho-Ming Tong |
1993-07-20 |
| 5189363 |
Integrated circuit testing system having a cantilevered contact lead probe pattern mounted on a flexible tape for interconnecting an integrated circuit to a tester |
Paul R. Hoffman, Peter G. Ledermann, Paul A. Moskowitz, Roger A. Pollak, Timothy C. Reiley +1 more |
1993-02-23 |
| 5117275 |
Electronic substrate multiple location conductor attachment technology |
Raymond R. Horton, Alphonso P. Lanzetta, Ismail C. Noyan, Michael J. Palmer, Ho-Ming Tong |
1992-05-26 |
| 5093890 |
Optical bus for computer systems |
Ismail C. Noyan, Mark B. Ritter, Harold S. Stone |
1992-03-03 |
| 5093879 |
Electro-optical connectors |
William D. Brewer, Mitchell S. Cohen, Glen Walden Johnson, Ismail C. Noyan, Modest M. Oprysko +3 more |
1992-03-03 |
| 5028983 |
Multilevel integrated circuit packaging structures |
Harry R. Bickford, Thomas M. Cipolla, John Gow, 3rd, Peter G. Ledermann, Ekkehard F. Miersch +5 more |
1991-07-02 |
| 5006925 |
Three dimensional microelectric packaging |
Raymond R. Horton, Ismail C. Noyan, Michael J. Palmer |
1991-04-09 |
| 4862322 |
Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween |
Harry R. Bickford, Paul A. Moskowitz, Michael J. Palmer, Timothy C. Reiley, Paige A. Poore +1 more |
1989-08-29 |
